研究目的
To propose and apply a novel decoupling structure composed of an I-shaped microstrip line and an X-shaped slot to reduce mutual coupling in a conventional antenna array operating at 5.25GHz.
研究成果
The proposed decoupling structure effectively reduces mutual coupling by up to 34.2dB, improves isolation to over 20dB within a bandwidth of 5.14-5.32GHz, and enhances gain. It is suitable for application in multi-element antenna arrays and communication systems, despite minor issues with frequency deviation and backward radiation.
研究不足
The decoupling structure causes a slight deviation in the resonant frequency and worsens backward radiation due to energy leakage from the slot. These drawbacks are inherent in designs using defected ground structures (DGS) for decoupling.
1：Experimental Design and Method Selection:
The study involves designing a decoupling structure for a two-element H-plane microstrip antenna array. The structure consists of an I-shaped microstrip line connected to the ground via metallic vias and an X-shaped slot etched in the ground plane. Simulations are conducted using HFSS software to analyze parameters and performance.
2：Sample Selection and Data Sources:
The antenna array is printed on an F4B substrate with specific dimensions (Lg=80mm, Wg=50mm) and material properties (relative permittivity 2.65, loss tangent 0.001, thickness 1.5mm). The edge-to-edge distance d is varied from 6mm to 18mm, with a typical value of 10mm used for detailed analysis.
3：65, loss tangent 001, thickness 5mm). The edge-to-edge distance d is varied from 6mm to 18mm, with a typical value of 10mm used for detailed analysis.
List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: F4B substrate, coaxial probes for feeding, metallic vias, simulation software HFSS.
4：Experimental Procedures and Operational Workflow:
The reference antenna array is designed and simulated. The decoupling structure is added, and parameter sweeps (e.g., l1, l2, l3) are performed in HFSS to optimize decoupling. S-parameters, radiation patterns, and current distributions are analyzed.
5：Data Analysis Methods:
S-parameters (e.g., S21 for mutual coupling), impedance bandwidth, isolation levels, gain, and radiation patterns are evaluated using simulation results from HFSS.
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