研究目的
To develop a convenient and inexpensive method for fabricating flexible conducting films using electrospun polyurethane fibers and electroless copper deposition for applications in wearable electronics.
研究成果
The developed Cu-PU films exhibit excellent flexibility, conductivity, and machinability, with stable performance under bending and folding. They can sense tensile strain and provide efficient Joule heating, making them suitable for wearable electronics such as strain sensors and heating garments. The method is simple, cost-effective, and uses abundant materials, offering potential for advancements in flexible electronic products.
研究不足
The tensile strength resistance is not high, requiring a supporting base to prevent damage from overstretching. Longer deposition times reduce flexibility without improving conductivity. The method may have scalability issues for large-area applications.
1：Experimental Design and Method Selection:
The study uses electrospinning to create polyurethane (PU) fiber substrates, followed by oxygen plasma treatment for surface modification, silver seeding via immersion in silver nitrate solution, and electroless copper deposition to form conductive films. The rationale is to achieve flexibility, conductivity, and cost-effectiveness.
2：Sample Selection and Data Sources:
PU fibers are electrospun under varying voltages (5-17 kV) to optimize uniformity. Samples are characterized using SEM, EDS, and resistance measurements.
3：List of Experimental Equipment and Materials:
Electrospinning setup, oxygen plasma treatment system, silver nitrate solution, electroless copper deposition bath, SEM, EDS analyzer, multimeter for resistance measurement, infrared camera for thermal imaging.
4：Experimental Procedures and Operational Workflow:
Electrospin PU fibers, treat with oxygen plasma to make hydrophilic, immerse in silver nitrate to seed silver catalysts, perform electroless copper deposition for varying times (1-50 min), characterize with SEM and EDS, measure resistance, conduct bending and folding tests, test strain sensing on finger joints, and evaluate Joule heating performance.
5：Data Analysis Methods:
Resistance data is analyzed to determine conductivity stability; SEM and EDS images are used to observe copper deposition and uniformity; thermal data from infrared imaging is used to assess heating performance; statistical analysis of bending cycles and strain responses is performed.
独家科研数据包，助您复现前沿成果，加速创新突破
获取完整内容-
Electrospinning setup
Used to electrospin polyurethane fibers into flexible films.
-
Oxygen plasma treatment system
Modifies the surface of PU films to make them superhydrophilic for better wettability in aqueous solutions.
-
Silver nitrate solution
Used to impregnate PU fibers and introduce silver seeds as catalytic centers for electroless copper deposition.
-
Electroless copper deposition bath
Deposits copper onto the silver-seeded PU fibers to form conductive films.
-
SEM
Used to obtain scanning electron microscopy images of the fibers at various stages of the process.
-
EDS analyzer
Performs energy-dispersive X-ray spectroscopy for elemental mapping to confirm copper and silver distribution on the fibers.
-
Multimeter
Measures the electrical resistance of the Cu-PU films.
-
Infrared camera
Captures infrared images to assess the thermal performance of the heating films.
-
Medical-grade adhesive tape
JNJ 6092793
JNJ
Used to attach Cu-PU films during bending tests to ensure no tension is induced.
-
登录查看剩余7件设备及参数对照表
查看全部
