研究目的
To examine the suitability of GaN fins for application in electronic and optoelectronic devices with regard to threading dislocations and impurity incorporation.
研究成果
GaN fins exhibit ultra-low threading dislocation densities on nonpolar sidewalls, making them competitive with bulk GaN substrates. The central region shows high impurity incorporation and carrier compensation, while sidewall regions are high-quality with strong NBE emission and high carrier concentration, suitable for devices like core-shell LEDs and vertical electronics.
研究不足
The study is limited to GaN fins on specific templates; the growth model may not generalize to other materials or conditions. Marker layers perturb the growth process, affecting sidewall smoothness. Statistical relevance of TD density measurements is limited by sample size and preparation complexity.
1:Experimental Design and Method Selection:
GaN fins were fabricated by selective area growth using metalorganic vapor phase epitaxy (MOVPE) in a continuous growth mode on SiOx/GaN/sapphire templates. The growth process was optimized for smooth sidewalls and high homogeneity. Marker layer experiments were conducted to study growth evolution.
2:Sample Selection and Data Sources:
Samples were GaN fins with various nominal widths and pitches, grown on templates with structured SiOx masks aligned along the m-direction of the GaN buffer layer.
3:List of Experimental Equipment and Materials:
Equipment includes a Thomas Swan close-coupled showerhead MOVPE reactor, Tescan Mira3 GMH SEM, Gatan MonoCL4 detection setup, Kammrath & Weiss C.80 cryo-stage, JEOL JEM-2100F STEM, JEOL JIB-4501 FIB, and SIMS for impurity analysis. Materials include GaN, SiOx, and sapphire substrates.
4:Experimental Procedures and Operational Workflow:
The process involved photolithography for mask patterning, MOVPE growth with optimized parameters, SEM and CL measurements for structural and optical analysis, STEM for dislocation studies, and SIMS for impurity profiling.
5:Data Analysis Methods:
Data were analyzed using CL spectra and maps, STEM images, SIMS depth profiles, and scanning capacitance microscopy for carrier concentration measurements.
独家科研数据包,助您复现前沿成果,加速创新突破
获取完整内容