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Preparation of Conductive Polyester Fibers Using Continuous Two-Step Plating Silver
摘要： Polyester ?bers are used in various ?elds, due to their excellent mechanical and chemical stability. However, the lack of conductivity limits their application potential. In order to prepare conductive polyester ?bers, silver is one of the most widely used materials to coat the surface of the ?bers. This work aimed to prepare silver-coated polyester ?bers by a continuous two-step method, which combined the operations of continuous electroless plating and electroplating. Meanwhile, we designed specialized equipment for the continuous plating of silver on the polyester ?bers under a dynamic condition. The mechanical property, washability, electrical resistivity, and electrical conductivity of the resultant conductive polyester ?bers obtained from different silver-plating conditions were also characterized. The results demonstrated that the conductive ?bers prepared by continuous two-step silver plating equipment, had good electrical conductivity with better mechanical properties and washability.
关键词： electroplating,polyester ?ber,continuous two-step silver plating,electroless plating,dynamic condition
更新于2025-09-09 09:28:46
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Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules
摘要： The thermal cycling life of direct bonded aluminum (DBA) and active metal brazing (AMB) substrates with two types of plating—Ni electroplating and Ni–P electroless plating—was evaluated by thermal shock tests between ?50 and 250 ?C. AMB substrates with Al2O3 and AlN fractured only after 10 cycles, but with Si3N4 ceramic, they retained good thermal stability even beyond 1000 cycles, regardless of the metallization type. The Ni layer on the surviving AMB substrates with Si3N4 was not damaged, while a crack occurred in the Ni–P layer. For DBA substrates, fracture did not occur up to 1000 cycles for all kind of ceramics. On the other hand, the Ni–P layer was roughened and cracked according to the severe deformation of the aluminum layer, while the Ni layer was not damaged after thermal shock tests. In addition, the deformation mechanism of an Al plate on a ceramic substrate was investigated both by microstructural observation and ?nite element method (FEM) simulation, which con?rmed that grain boundary sliding was a key factor in the severe deformation of the Al layer that resulted in the cracking of the Ni–P layer. The fracture suppression in the Ni layer on DBA/AMB substrates can be attributed to its ductility and higher strength compared with those of Ni–P plating.
关键词： DBA,cracking,Ni–P electroless plating,Ni electroplating,reliability,grain boundary sliding,AMB,thermal shock test,roughness,metallization
更新于2025-09-09 09:28:46