- 标题
- 摘要
- 关键词
- 实验方案
- 产品
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Tilted Fiber Bragg Grating Sensor Using Chemical Plating of a Palladium Membrane for the Detection of Hydrogen Leakage
摘要： A tilted ?ber Bragg grating (TFBG) hydrogen sensor coated with a palladium (Pd) membrane by the electroless plating method is proposed in this paper. A uniform layer of Pd metal is fabricated in aqueous solutions by the chemical coating method, which is used as the sensitive element to detect the change of the surrounding refractive index (SRI) caused by hydrogen absorption. The change in SRI causes an unsynchronized change of the cladding modes and the Bragg peak in the TFBG transmission spectrum, thereby eliminating the cross-sensitivity due to membrane expansion and is able to simultaneously monitor the presence of cracks in the pipe, as well as the hydrogen leakage. By subtracting the wavelength shift caused by ?ber expansion, the change of SRI, i.e., the information from the H2 level, can be separately obtained. The drifted wavelength is measured for the H2 concentration below the hydrogen explosion limit between 1% and 4%. The chemical-based coating has the advantages of a low cost, a simple operation, and being suitable for coating on long ?ber structures. The proposed sensor is able to detect the H2 signal in 5 min at a 1% H2 concentration. The proposed sensor is proved to be able to monitor the hydrogen level without the cross-sensitivity of temperature variation and expansion strains, so could be a good candidate for security applications in industry.
关键词： electroless plating,tilted ?ber Bragg grating,optical ?ber hydrogen sensor,palladium membrane
更新于2025-09-23 15:22:29
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Separation of Si and SiC from Photovoltaic Industry Waste. Recycling of SiC in Production of Cu2O-SiC Powder
摘要： Silicon ingot cutting process generates slurry waste which mainly contains lubricant oil, silicon and silicon carbide particles. In this study, slurry waste was the subject of a primary decantation which served to obtain two different effluents namely dark sludge (DS) and dark liquid (DL). Deoiling treatment of DS and DL using acetone was carried out. The resulting powders were first leached by nitric acid to remove heavy metals and then washed by distilled water to separate Si and SiC. Scanning electron microscopy (SEM) coupled to energy dispersive x-ray spectrometry (EDXS) and x-ray diffraction (XRD) show a successful separation of Si and SiC particles. As reuse of SiC-rich powder, a Cu2O-SiC composite was synthesized by electroless plating process under experimental controlled parameters.
关键词： Composite,Silicon,Silicon carbide,Electroless plating,Slurry waste
更新于2025-09-23 15:19:57
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[IEEE 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Chicago, IL, USA (2019.6.16-2019.6.21)] 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC) - Nanoprobe-Enabled Electron Beam Induced Current Measurements on III-V Nanowire-Based Solar Cells
摘要： The development of two new types of high-density, electroless plated microelectrode arrays for CMOS-based high-sensitivity direct bacteria and HeLa cell counting are presented. For emerging high-sensitivity direct pathogen counting, two technical challenges must be addressed. One is the formation of a bacteria-sized microelectrode, and the other is the development of a high-sensitivity and high-speed amperometry circuit. The requirement for microelectrode formation is that the gold microelectrodes are required to be as small as the target cell. By improving a self-aligned electroless plating technique, the dimensions of the microelectrodes on a CMOS sensor chip in this work were successfully reduced to 1.2 μm × 2.05 μm. This is 1/20th of the smallest size reported in the literature. Since a bacteria-sized microelectrode has a severe limitation on the current flow, the amperometry circuit has to have a high sensitivity and high speed with low noise. In this work, a current buffer was inserted to mitigate the potential fluctuation. Three test chips were fabricated using a 0.6-μm CMOS process: two with 1.2 μm × 2.05 μm 1024 × 1024 and 4 μm × 4 μm (16 × 16) sensor arrays and one with 6-μm × 6-μm (16 × 16) sensor arrays; and the microelectrodes were formed on them using electroless plating. The uniformity among the 1024 × 1024 electrodes arranged with a pitch of 3.6 μm × 4.45 μm was optically verified. For improving sensitivity, the trenches on each microelectrode were developed and verified optically and electrochemically for the first time. Higher sensitivity can be achieved by introducing a trench structure than by using a conventional microelectrode formed by contact photolithography. Cyclic voltammetry (CV) measurements obtained using the 1.2 μm × 2.05 μm 16 × 16 and 6-μm × 6-μm 16 × 16 sensor arrays with electroless-plated microelectrodes successfully demonstrated direct counting of the bacteria-sized microbeads and HeLa cells.
关键词： Bacteria counting,HeLa cells,electroless plating,point-of-care testing,CMOS,microelectrode array
更新于2025-09-23 15:19:57
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[IEEE 2019 IEEE 4th Advanced Information Technology, Electronic and Automation Control Conference (IAEAC) - Chengdu, China (2019.12.20-2019.12.22)] 2019 IEEE 4th Advanced Information Technology, Electronic and Automation Control Conference (IAEAC) - Deterministic hierarchical joint remote state preparation using partially entangled quantum channel
摘要： The development of two new types of high-density, electroless plated microelectrode arrays for CMOS-based high-sensitivity direct bacteria and HeLa cell counting are presented. For emerging high-sensitivity direct pathogen counting, two technical challenges must be addressed. One is the formation of a bacteria-sized microelectrode, and the other is the development of a high-sensitivity and high-speed amperometry circuit. The requirement for microelectrode formation is that the gold microelectrodes are required to be as small as the target cell. By improving a self-aligned electroless plating technique, the dimensions of the microelectrodes on a CMOS sensor chip in this work were successfully reduced to 1.2 μm × 2.05 μm. This is 1/20th of the smallest size reported in the literature. Since a bacteria-sized microelectrode has a severe limitation on the current flow, the amperometry circuit has to have a high sensitivity and high speed with low noise. In this work, a current buffer was inserted to mitigate the potential fluctuation. Three test chips were fabricated using a 0.6-μm CMOS process: two with 1.2 μm × 2.05 μm 1024 × 1024 and 4 μm × 4 μm (16 × 4) sensor arrays and one with 6-μm × 6-μm (16 × 16) sensor arrays; and the microelectrodes were formed on them using electroless plating. The uniformity among the 1024 × 1024 electrodes arranged with a pitch of 3.6 μm × 4.45 μm was optically verified. For improving sensitivity, the trenches on each microelectrode were developed and verified optically and electrochemically for the first time. Higher sensitivity can be achieved by introducing a trench structure than by using a conventional microelectrode formed by contact photolithography. Cyclic voltammetry (CV) measurements obtained using the 1.2 μm × 2.05 μm 16 × 4 and 6-μm × 6-μm 16 × 16 sensor arrays with electroless-plated microelectrodes successfully demonstrated direct counting of the bacteria-sized microbeads and HeLa cells.
关键词： microelectrode array,point-of-care testing,HeLa cells,electroless plating,Bacteria counting,CMOS
更新于2025-09-23 15:19:57
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Facile Synthesis of SiO <sub/>2</sub> –Ni Raspberry Composites by Electroless Plating and Polyelectrolyte Adsorption
摘要： Surface of mono-dispersed silica (SiO2) particles was modified by cationic polydiallyldimethylammonium chloride with an aim that negatively charged tetrachloropalladate (PdCl2?4) ions can be grafted electrostatically on the SiO2 surface in aqueous solutions. The PdCl2?4 ions changed into Pd(0) upon adsorption and acted as surface active sites for subsequent electroless nickel (Ni) deposition when sodium hypophosphite monohydrate was used as the reducing agent. By using nickel chloride as the metal precursor, SiO2–Ni raspberry-like nanocomposite particles were prepared. Morphology of the raspberry-like particles was examined when process variables such as reaction temperature, precursor concentration, and reducing agent concentration in the aqueous electroless plating were varied. Surface characteristics and microstructure of the SiO2–Ni particles were examined by electron microscopy, X-ray photoelectron spectroscopy, and X-ray diffractometry.
关键词： Composite,Electroless Plating,Ni,Polyelectrolyte,Pd,SiO2
更新于2025-09-19 17:15:36
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[IEEE 2019 10th IEEE International Conference on Intelligent Data Acquisition and Advanced Computing Systems: Technology and Applications (IDAACS) - Metz, France (2019.9.18-2019.9.21)] 2019 10th IEEE International Conference on Intelligent Data Acquisition and Advanced Computing Systems: Technology and Applications (IDAACS) - Solar Cell Data Acquisition System
摘要： The development of two new types of high-density, electroless plated microelectrode arrays for CMOS-based high-sensitivity direct bacteria and HeLa cell counting are presented. For emerging high-sensitivity direct pathogen counting, two technical challenges must be addressed. One is the formation of a bacteria-sized microelectrode, and the other is the development of a high-sensitivity and high-speed amperometry circuit. The requirement for microelectrode formation is that the gold microelectrodes are required to be as small as the target cell. By improving a self-aligned electroless plating technique, the dimensions of the microelectrodes on a CMOS sensor chip in this work were successfully reduced to 1.2 μm × 2.05 μm. This is 1/20th of the smallest size reported in the literature. Since a bacteria-sized microelectrode has a severe limitation on the current flow, the amperometry circuit has to have a high sensitivity and high speed with low noise. In this work, a current buffer was inserted to mitigate the potential fluctuation. Three test chips were fabricated using a 0.6-μm CMOS process: two with 1.2 μm × 2.05 μm 1024 × 1024 and 4 μm × 4 μm (16 × 4) sensor arrays and one with 6-μm × 6-μm (16 × 16) sensor arrays; and the microelectrodes were formed on them using electroless plating. The uniformity among the 1024 × 1024 electrodes arranged with a pitch of 3.6 μm × 4.45 μm was optically verified. For improving sensitivity, the trenches on each microelectrode were developed and verified optically and electrochemically for the first time. Higher sensitivity can be achieved by introducing a trench structure than by using a conventional microelectrode formed by contact photolithography. Cyclic voltammetry (CV) measurements obtained using the 1.2 μm × 2.05 μm 16 × 4 and 6-μm × 6-μm 16 × 16 sensor array with electroless-plated microelectrodes successfully demonstrated direct counting of the bacteria-sized microbeads and HeLa cells.
关键词： microelectrode array,point-of-care testing,HeLa cells,electroless plating,Bacteria counting,CMOS
更新于2025-09-19 17:13:59
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[IEEE 2019 Photonics North (PN) - Quebec City, QC, Canada (2019.5.21-2019.5.23)] 2019 Photonics North (PN) - Femtosecond Laser Opening of Hollow-Filament Arrays: the Fiber Bragg Grating Opto-fluidic Sensor
摘要： The development of two new types of high-density, electroless plated microelectrode arrays for CMOS-based high-sensitivity direct bacteria and HeLa cell counting are presented. For emerging high-sensitivity direct pathogen counting, two technical challenges must be addressed. One is the formation of a bacteria-sized microelectrode, and the other is the development of a high-sensitivity and high-speed amperometry circuit. The requirement for microelectrode formation is that the gold microelectrodes are required to be as small as the target cell. By improving a self-aligned electroless plating technique, the dimensions of the microelectrodes on a CMOS sensor chip in this work were successfully reduced to 1.2 μm × 2.05 μm. This is 1/20th of the smallest size reported in the literature. Since a bacteria-sized microelectrode has a severe limitation on the current flow, the amperometry circuit has to have a high sensitivity and high speed with low noise. In this work, a current buffer was inserted to mitigate the potential fluctuation. Three test chips were fabricated using a 0.6-μm CMOS process: two with 1.2 μm × 2.05 μm 1024 × 1024 and 4 μm × 4 μm (16 × 4) sensor arrays and one with 6-μm × 6-μm (16 × 16) sensor arrays; and the microelectrodes were formed on them using electroless plating. The uniformity among the 1024 × 1024 electrodes arranged with a pitch of 3.6 μm × 4.45 μm was optically verified. For improving sensitivity, the trenches on each microelectrode were developed and verified optically and electrochemically for the first time. Higher sensitivity can be achieved by introducing a trench structure than by using a conventional microelectrode formed by contact photolithography. Cyclic voltammetry (CV) measurements obtained using the 1.2 μm × 2.05 μm 16 × 4 and 6-μm × 6-μm 16 × 16 sensor array with electroless-plated microelectrodes successfully demonstrated direct counting of the bacteria-sized microbeads and HeLa cells.
关键词： microelectrode array,point-of-care testing,HeLa cells,electroless plating,Bacteria counting,CMOS
更新于2025-09-19 17:13:59
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Evaluation and optimisation of the SSAIL method for laser-assisted selective electroless copper deposition on dielectrics
摘要： Formation of electrical circuit traces on 3D shaped dielectrics is one of the biggest challenges in 3D Microscopic Integrated Devices (3D-MID). We have developed a new method called “Selective Surface Activation Induced by a Laser” (SSAIL), which is a promising technology for solving emerged production issues for electrical conductors on polymers. SSAIL contains 3 main steps: laser modification of the dielectric surface, chemical activation of the modified areas and electroless plating of the activated parts. In this paper, the route and results on optimisation of the SSAIL process by evaluating properties of the final metal-plated traces are provided. A special validation method of the technology based on the quality and reliability of the plating has been proposed. The sheet resistance, adhesion strength to the substrate and spatial selectivity of plated copper were used to find the optimal laser processing parameters.
关键词： Selective electroless plating,Laser activation,Moulded interconnect devices,Polymer,Electric circuit,Evaluation and optimisation
更新于2025-09-16 10:30:52
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Doping of Alumina Substrates for Laser Induced Selective Metallization
摘要： Laser induced selective activation and metallization of ceramics is a novel additive metal plating process enabling the application fine metallic paths or metallic surfaces on complex three-dimensionally shaped ceramic substrates. Metal deposition by electroless plating occurs selectively where the substrate has been locally activated by a preceding selective laser activation. The main influences on the process are the ceramic substrate material, its microstructural and optical properties as well as the laser type, laser process parameters and metallization parameters. Recent positive results with activation by a green picosecond laser were obtained only with oxygen vacancy containing alumina substrates sintered in hydrogen atmosphere. In order to be able to apply inexpensive conventional state-of-the-art sintering in air it was tried to modify the composition by doping with different oxides. 2 mass-% of fine particles of neodymium-, manganese-, samarium-, chromium-, nickel- iron-, ceria- and antimony doped tin-oxide were introduced into an alumina matrix by mixing and milling. Slip cast samples were sintered at 1500°C in air and machined. Laser activation was performed on polished sample surfaces using a Nd:YVO4 laser with a wavelength of 532 nm and a pulse length of 10 ps. Electroless plating was performed with commercially available copper electrolytes. Microstructural properties, laser-matter interaction and metallization effectivity were investigated. Doping of alumina substrates with antimony doped tin-oxide, chromium-, iron- and nickel-oxide results in very good metallization of laser activated areas. Dopants enable plating larger areas and writing fine circuit paths to integrate microelectronic devices. Other additives were ineffective. The activation mechanisms triggered by the dopants is not fully understood yet. Separation and identification of single mechanisms of the dopants is required. The influence of dopants and laser activation on the mechanical properties is to be studied.
关键词： laser activation,alumina,3D interconnect device,slip casting,Ceramics,electroless plating
更新于2025-09-12 10:27:22
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Laser assisted fabrication of copper traces on dielectrics by electroless plating
摘要： A new technology for circuit traces production: Selective Surface Activation Induced by Laser (SSAIL) enables to fabricate fine metallic structure on dielectric materials – polymers and glass. SSAIL contains three main steps: The first step is surface modification by laser, second – chemical activation of modified areas and the last step is metal deposition by electroless plating. A Picosecond laser was used for writing. The method has been investigated in detail for wide window of laser processing parameters. Sheet resistance measurement of finally plated sample and laser processed surface roughness measurement were carried out. This new technique can reduce production cost of circuit traces for molded interconnect devices.
关键词： MID,selective,circuit,laser,plastic,electroless plating
更新于2025-09-12 10:27:22