研究目的
Investigating the fabrication of fine metallic structures on dielectric materials using Selective Surface Activation Induced by Laser (SSAIL) technology to reduce production costs of circuit traces for molded interconnect devices.
研究成果
PC/ABS Bayblend T65 XF polymer without any LDS additives can be selectively metal plated using the SSAIL method. The technique allows reaching the width of plated line and the separation distance between them in the range of tens of microns. Selective activation of polymer surface processed by a laser is not only driven by increased surface area of modified surface. Moreover catalyst could be forced by coulomb attraction to laser treated areas.
研究不足
The full mechanism of activation process is not fully understood yet. The method requires precise control of the parameters of activation step.
1：Experimental Design and Method Selection:
The SSAIL method involves three main steps: surface modification by laser, chemical activation of modified areas, and metal deposition by electroless plating. A Picosecond laser was used for writing.
2：Sample Selection and Data Sources:
Standard PC/ABS polymer T65 XF from Bayer was used. The plaques of 3 mm thickness were produced by injection moulding.
3：List of Experimental Equipment and Materials:
A mode-locked Nd:YVO4 laser (PL10100, Ekspla) with a pulse duration of 10 ps was utilized. The copper bath contained copper sulphate, sodium potassium tartrate, sodium hydroxide, sodium carbonate, and formaldehyde.
4：Experimental Procedures and Operational Workflow:
The experiments were performed by changing the scanning speed, the average power of the laser, and pulse repetition rate. After laser processing, specimens were immersed in a chemical activation liquid solution and then electroless plated in a copper bath.
5：Data Analysis Methods:
Sheet resistance measurements were applied for evaluation the plated surface quality using four probe method. Surface roughness was measured by stylus profilometer DEKTAK 100.
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