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[Lecture Notes in Mechanical Engineering] Advances in Thin Films, Nanostructured Materials, and Coatings (Selected Papers from the 2018 International Conference on “Nanomaterials: Applications & Properties”) || Stain Effect on the Properties of Polar Dielectric Thin Films
摘要： Low cost scalable processing and substrates are critical for optimized polar dielectric performance of functional oxide thin ?lms if they are to achieve commercialization. Here, we present a comprehensive investigation of the role low-cost MgO, Al2O3, SrTiO3 and Si substrates on the structural and electrical properties of sol-gel derived SrTiO3 (ST) and K0.5Na0.5NbO3 (KNN) thin ?lms. The substrate is found to have a strong effect on the stress/stain state and, consequently, on the dielectric and ferroelectric response of the ?lms. A tensile stress induced in-plane by the thermal expansion mismatch between the substrates and the ?lms observed for ST and KNN ?lms deposited on platinized Al2O3 and Si substrates, respectively, lowers the relative permittivity and remanent polarization values in the parallel plate capacitor geometry. In contrast, a compressive stress/strain observed for ST ?lms deposited on MgO/Pt and KNN ?lms on SrTiO3/Pt substrates result in superior polarization and dielectric permittivity, corresponding to enhanced out-of-plane displacement of Ti4+ ions in ST ?lms and Nb5+ ions in KNN ?lms. It is thus demonstrated that for polycrystalline polar dielectric thin ?lms the relative permittivity and polarization may be optimized through an induced compressive stress state.
关键词： Dielectric properties,Sol-gel,Thin ?lms,Stress/strain,Thermal expansion,Ferroelectric hysteresis
更新于2025-11-14 17:28:48
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Effect of laser forming on mechanical properties of multiple-phase steels by using a thermal–microstructure–mechanical model
摘要： Based on a forming temperature-controlled mixed strain-hardening law, a temperature-controlled thermal–microstructure–mechanical model was developed to predict the deformation in ferrite–martensite dual-phase steel before and after complex laser forming. Phase transformation in dual phase steel was predicted by coupling a kinetic transformation model with the developed model during laser forming. The corresponding algorithm of the constitutive model was used in three-dimensional finite element method to simulate the material deformation and mechanical properties during the laser forming. The simulated results agree well with the experimental results. Laser forming influences the mechanical properties of the material significantly, leads to bending deformation of the scanned sample and induces a ferrite-to-martensite transformation. The influence of scanning line number on the tensile strength and bending deformation of the scanned specimen was investigated. The tensile strength and bending angle are related positively to the number of scanning lines on the sample.
关键词： Stress-strain curve,Phase transformation,Thermal–microstructure–mechanical model,Sheet metal,Laser forming
更新于2025-09-23 15:23:52
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[IEEE 2018 International Multi-Conference on Industrial Engineering and Modern Technologies (FarEastCon) - Vladivostok, Russia (2018.10.3-2018.10.4)] 2018 International Multi-Conference on Industrial Engineering and Modern Technologies (FarEastCon) - Experimental Study of the Stress-Strain State Features of Outlet Guide Vane Made From Polymer Composite Material Using Fiber Optic Sensors
摘要： An estimation technique for the stress-strain state of the outlet guide vane design of an aircraft propulsion system made of polymer composite materials (PCM) using fiber-optic sensors is proposed. Fiber-optic sensors allow creating details with the possibility of self-diagnosis and forecasting the resource of work. This issue is particularly relevant when using PCM in highly loaded aircraft engine elements. The object of the study is the outlet guide vane (OGV) made of an equally strong carbon cloth on an epoxy binder. The tests were carried out on a universal servo-hydraulic machine. The data from fiber-optic sensors was carried out using an interrogator ASTRO X327. The comparison of the experiment and the numerical calculation were performed using the software package ANSYS.
关键词： polymer composite material,fiber optic sensors,numerical calculations,stress-strain state
更新于2025-09-23 15:23:52
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[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling
摘要： Fatigue failure of solder joints is one of the most common methods by which electronic packages fail. Electronic assemblies usually must cope with a temperature varying environment. Due to the mismatches in coefficients of thermal expansion (CTEs) of the various assembly materials, the solder joints are subjected to cyclic thermal-mechanical loading during temperature cycling. The main focus of this work is to investigate the changes in microstructure that occur in SAC305 and SAC+Bi lead free solders subjected to mechanical cycling. In this paper, we report on results for the SAC+Bi solder commonly known as SAC_Q or CYCLOMAX. Uniaxial solder specimens were prepared in glass tubes, and the outside surfaces were polished. A nanoindenter was then used to mark fixed regions on the samples for subsequent microscopy evaluation. The samples were subjected to mechanical cycling, and the microstructures of the selected fixed regions were recorded after various durations of cycling using Scanning Electron Microscopy (SEM). Using the recorded images, it was observed that the cycling induced damage consisted primarily of small intergranular cracks forming along the subgrain boundaries within dendrites. These cracks continued to grow as the cycling continued, resulting in a weakening of the dendrite structure, and eventually to the formation of large transgranular cracks. The distribution and size of the intermetallic particles in the inter-dendritic regions were observed to remain essentially unchanged.
关键词： Bismuth,Microstructure,SAC Alloy,Hysteresis,Evolution,Lead Free Solder,Cyclic Stress-Strain Curve
更新于2025-09-23 15:22:29
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[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders
摘要： Lead free solders are renowned as interconnects in electronic packaging due to their relatively high melting point, attractive mechanical properties, thermal cycling reliability, and environment friendly chemical properties. The mechanical behavior of lead free solders is highly dependent on the operating temperature. Previous investigations on mechanical characterization of lead free solders have mainly emphasized stress-strain and creep testing at temperatures up to 125 °C. However, electronic devices, sometimes, experience harsh environment applications including well drilling, geothermal energy, automotive power electronics, and aerospace engines where solders are exposed to very high temperatures from 125-200 °C. Mechanical properties of lead free solders at elevated temperatures are limited. In this work, we have investigated the mechanical behavior SAC305 (96.5Sn-3.0Ag-0.5Cu) and SAC_Q (SAC+Bi) lead free solders at extreme high temperatures up to 200 °C. Stress-strain tests were performed on reflowed uniaxial specimens at four elevated temperatures (T = 125, 150, 175, and 200 °C). In addition, changes of the mechanical behavior of these alloys due to isothermal aging at T = 125 oC have been studied. Extreme care has been taken during specimen preparation so that the fabricated solder uniaxial test specimens accurately reflect the solder material microstructures present in actual lead free solder joints. High temperature tensile properties of the solders including initial modulus, yield stress, and ultimate tensile strength have been compared. As expected, our results show substantial degradations of the mechanical properties of lead-free solders at higher temperatures. With prior aging, these degradations become even more significant. Comparison of the results has shown that the addition of Bi to traditional SAC alloys improves their high temperature properties and significantly reduces their aging induced degradations.
关键词： Yield Stress,Ultimate Tensile Strength,Stress-Strain Curve,SAC alloy,Modulus,Lead-Free Solder,Aging
更新于2025-09-09 09:28:46
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[IEEE 2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Austin, TX, USA (2018.9.24-2018.9.26)] 2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - A General Approach for Deformation Induced Stress on Flexible Electronics
摘要： We present a simulation approach that is based on non-linear finite element method. This simulation flow allows to calculate large deformation field and associated stress and strain. The obtained simulation result agrees well with analytic solution. We extend this simulation method to evaluate the impacts of the deformation induced stress on device performance as well as structural integrity.
关键词： bending stress,strain,deformation,flexible devices
更新于2025-09-09 09:28:46
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Strain-Mediated Substrate Effect on the Dielectric and Ferroelectric Response of Potassium Sodium Niobate Thin Films
摘要： If piezoelectric thin films sensors based on K0.5Na0.5NbO3 (KNN) are to achieve commercialization, it is critical to optimize the film performance using low-cost scalable processing and substrates. Here, sol–gel derived KNN thin films are deposited using a solution with 5% of potassium excess on Pt/TiO2/SiO2/Si and Pt/SrTiO3 substrates, and rapid thermal annealed at 750 ?C for 5 min. Despite an identical film morphology and thickness of ~335 nm, an in-plane stress/strain state is found to be tensile for KNN films on Pt/TiO2/SiO2/Si, and compressive for those on Pt/SrTiO3 substrates, being related to thermal expansion mismatch between the substrate and the film. Correspondingly, KNN films under in-plane compressive stress possess superior dielectric permittivity and polarization in the parallel-plate-capacitor geometry.
关键词： stress/strain,ferroelectric hysteresis,dielectric properties,KNN thin films,sol–gel,thermal expansion
更新于2025-09-04 15:30:14