[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Indium Sealing of Metal Shell for Precision Devices Packaging

摘要： The indium seal quality of metal shell is crucial for avoiding the failure of precision devices. It is necessary to study the sealing process to increase the tightness of the cavity. The temperature field and deformation during the indium sealing process of metal shell are simulated, and by optimizing the sealing process parameters to assure the quality of the sealing joint. The simulation results show that sealing pieces with superior strength and tightness can be obtained when the temperature of the upper hot-press head is 130oC and 50oC for the lower heating block, and the sealing force is 1500N. An automatic shell sealing equipment was developed, which has the function of controlling the processing parameters, including temperature, force and displacement. A group of sealing parameters are set up for sealing the shell. The results of experiments show that the tightness of sealing pieces can meet the requirements.