研究目的
To study the indium sealing process for metal shells in precision devices packaging to increase tightness and avoid failure, by simulating temperature fields and deformation, optimizing parameters, and developing automated equipment.
研究成果
The simulation and experimental results confirm that optimal sealing parameters (upper hot-press head at 130°C, lower heating block at 50°C, sealing force of 1500N) yield high-quality seals with superior strength and tightness. The developed equipment and process curve effectively avoid device failure and meet operational requirements, providing a theoretical basis for similar applications.
研究不足
The simulation simplifies the analysis by not considering thermal stress and external force effects on shell and base plate deformation due to their high stiffness. The study is specific to the described metal shell and indium sealing, and may not generalize to other materials or configurations without further optimization.
1：Experimental Design and Method Selection:
The study uses numerical simulation with ANSYS Workbench to analyze temperature fields and deformation during indium sealing, based on atomic diffusion theory and elastic-plastic theories. An automated sealing equipment is designed and experiments are conducted to verify sealing quality.
2：Sample Selection and Data Sources:
The metal shell, indium ring, and other components (e.g., T-shaped plate, circuit module) are modeled and used in simulations and experiments. Physical parameters are sourced from literature.
3：List of Experimental Equipment and Materials:
Includes the developed shell sealing equipment with upper hot-press head, lower heating block, grating ruler, cylinder with guide rod, leveling device, and industrial computer. Materials include indium wire, metal shell, base plate, and low expansion alloys.
4：Experimental Procedures and Operational Workflow:
The sealing process involves preheating on the lower heating block, applying force and heat with the upper hot-press head, maintaining parameters, and post-processing treatments (heat cycle, shock, vibration, humidity). Data on temperature, force, and displacement are collected.
5：Data Analysis Methods:
Simulation results are compared with experimental data (e.g., displacement, temperature). Leakage rates are measured using unspecified methods, and tensile tests are performed to assess strength.
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