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[IEEE 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Singapore, Singapore (2019.8.28-2019.8.30)] 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Toward Monolithic Optoelectronic Integration of GeSn Photodiode and FinFET on GeSnOI Platform
摘要： We demonstrated a GeSn-on-insulator platform for monolithic optoelectronic integration for applications at 2 μm wavelength. Both GeSn lateral p-i-n photodetector and p-channel fin field-effect transistor were realized using this novel architecture.
关键词： optoelectronic integration,2 μm,GeSn
更新于2025-09-16 10:30:52
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[IEEE 2018 Asia Communications and Photonics Conference (ACP) - Hangzhou (2018.10.26-2018.10.29)] 2018 Asia Communications and Photonics Conference (ACP) - A pair of integrated optoelectronic chips for optical interconnects
摘要： A pair of integrated optoelectronic chips based on VCSEL (Vertical-Cavity Surface-Emitting Laser) and PIN-PD is proposed for optical interconnects. The matched chips can realize bi-directional communications on a single fiber.
关键词： Optical interconnects,Optoelectronic integration,Laser,RCE-PD,VCSEL
更新于2025-09-12 10:27:22
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[IEEE 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Singapore, Singapore (2019.8.28-2019.8.30)] 2019 IEEE 16th International Conference on Group IV Photonics (GFP) - Toward Monolithic Optoelectronic Integration of GeSn Photodiode and FinFET on GeSnOI Platform
摘要： We demonstrated a GeSn-on-insulator platform for monolithic optoelectronic integration for applications at 2 μm wavelength. Both GeSn lateral p-i-n photodetector and p-channel fin field-effect transistor were realized using this novel architecture.
关键词： optoelectronic integration,2 μm,GeSn
更新于2025-09-11 14:15:04