- 标题
- 摘要
- 关键词
- 实验方案
- 产品
-
Femtosecond laser additive and subtractive micro-processing: enabling a high-channel-density silica interposer for multicore fibre to silicon-photonic packaging
摘要： Great strides have been made over the past decade to establish femtosecond lasers in advanced manufacturing systems for enabling new forms of non-contact processing of transparent materials. Research advances have shown that a myriad of additive and subtractive techniques is now possible for flexible 2D and 3D structuring of such materials with micro- and nano-scale precision. In this paper, these techniques have been refined and scaled up to demonstrate the potential for 3D writing of high-density optical packaging components, specifically addressing the major bottleneck for efficiently connecting optical fibres to silicon photonic (SiP) processors for use in telecom and data centres. An 84-channel fused silica interposer was introduced for high-density edge coupling of multicore fibres (MCFs) to a SiP chip. Femtosecond laser irradiation followed by chemical etching (FLICE) was further harnessed to open alignment sockets, permitting rapid assembly with precise locking of MCF positions for efficient coupling to laser written optical waveguides in the interposer. A 3D waveguide fanout design provided an attractive balancing of low losses, mode-matching, high channel density, compact footprint, and low crosstalk. The 3D additive and subtractive processes thus demonstrated the potential for higher scale integration and rapid photonic assembly and packaging of micro-optic components for telecom interconnects, with possible broader applications in integrated biophotonic chips or micro-displays.
关键词： multicore fibre,waveguide fanout,silicon photonics interposer,space-division multiplexing,fibre socket,femtosecond laser micro-processing,photonic packaging
更新于2025-09-23 15:19:57
-
[IEEE 2019 21st International Conference on Transparent Optical Networks (ICTON) - Angers, France (2019.7.9-2019.7.13)] 2019 21st International Conference on Transparent Optical Networks (ICTON) - Generation of Optical Combs based on Intensity Electro-Optic Modulators using a Differential Evolution Algorithm
摘要： Integrated photonics is a promising route toward high-performance next-generation ICT and sensing devices. Although fiber-packaging is perhaps the most widely discussed obstacle to low-cost photonic devices, electronic-photonic integration and thermal-stabilization are also significant design considerations that need to be properly managed. Using a state-of-the-art Si-photonic optical-network-unit as a worked example, we illustrate some key challenges and solutions in the field of photonic-packaging. Specifically, we describe a novel solder-reflow bonding process for the face-to-face three-dimensional (3-D) integration of photonic and electronic integrated circuits, discuss current and future multichannel fiber-alignment techniques, and investigate the coefficient-of-performance of the thermo-electric cooler that stabilizes the temperature of the photonic components. The challenge of photonic-packaging is to simultaneously satisfy these electrical, optical, and thermal design requirements on small-footprint devices, while establishing a route to scalable commercial implementation.
关键词： silicon photonics,Integrated optics,photonic packaging,optoelectronics
更新于2025-09-23 15:19:57
-
[IEEE 2019 Fifth International Conference on Image Information Processing (ICIIP) - Shimla, India (2019.11.15-2019.11.17)] 2019 Fifth International Conference on Image Information Processing (ICIIP) - NFGS Enabled Face Re-identification for Efficient Surveillance in Low Quality Video
摘要： Integrated photonics is a promising route toward high-performance next-generation ICT and sensing devices. Although fiber-packaging is perhaps the most widely discussed obstacle to low-cost photonic devices, electronic-photonic integration and thermal-stabilization are also significant design considerations that need to be properly managed. Using a state-of-the-art Si-photonic optical-network-unit as a worked example, we illustrate some key challenges and solutions in the field of photonic-packaging. Specifically, we describe a novel solder-reflow bonding process for the face-to-face three-dimensional (3-D) integration of photonic and electronic integrated circuits, discuss current and future multichannel fiber-alignment techniques, and investigate the coefficient-of-performance of the thermo-electric cooler that stabilizes the temperature of the photonic components. The challenge of photonic-packaging is to simultaneously satisfy these electrical, optical, and thermal design requirements on small-footprint devices, while establishing a route to scalable commercial implementation.
关键词： silicon photonics,Integrated optics,photonic packaging,optoelectronics
更新于2025-09-23 15:19:57