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[IEEE 2019 International Conference on Electrical, Electronics and Computer Engineering (UPCON) - ALIGARH, India (2019.11.8-2019.11.10)] 2019 International Conference on Electrical, Electronics and Computer Engineering (UPCON) - A Study on the Influence of Open Circuit Voltage (Voc) and Short Circuit Current (Isc) on Maximum Power Generated in a Photovoltaic Module/Array
摘要： A technique is described, to efficiently evaluate the reliability of an RF semiconductor device when several different mechanisms contribute simultaneously to its wearout. This is of interest for present-day GaN HEMT devices because symptoms of several simultaneous degradation mechanisms have been reported widely. The technique involves first finding DC parameters that are “signatures” of each mechanism. Then, separate DC-stress lifetests are performed to find the degradation rates for the signature parameters, at several temperatures, and the corresponding Arrhenius curves. Next, an RF-stress lifetest (with only one stress condition) is performed, while monitoring all of the signature parameters and the RF performance. This is utilized to determine the “scaling factors” between the rates of change in the DC lifetests and the rates of change in the RF application. Applying these scaling factors to the original Arrhenius curves gives an “overall” Arrhenius plot for the RF application with several different lines, for the different degradation mechanisms. The technique can be extended to further degradation mechanisms, by conducting further DC and RF lifetests while monitoring appropriate signature parameters.
关键词： semiconductor device reliability,lifetesting,gallium nitride,HEMTs,Failure analysis
更新于2025-09-23 15:19:57
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[IEEE 2019 IEEE International Ultrasonics Symposium (IUS) - Glasgow, United Kingdom (2019.10.6-2019.10.9)] 2019 IEEE International Ultrasonics Symposium (IUS) - Tiled Large Element 1.75D Aperture with Dual Array Modules by Adjacent Integration of PIN-PMN-PT Transducers and Custom High Voltage Switching ASICs
摘要： A technique is described, to efficiently evaluate the reliability of an RF semiconductor device when several different mechanisms contribute simultaneously to its wearout. This is of interest for present-day GaN HEMT devices because symptoms of several simultaneous degradation mechanisms have been reported widely. The technique involves first finding DC parameters that are “signatures” of each mechanism. Then, separate DC-stress lifetests are performed to find the degradation rates for the signature parameters, at several temperatures, and the corresponding Arrhenius curves. Next, an RF-stress lifetest (with only one stress condition) is performed, while monitoring all of the signature parameters and the RF performance. This is utilized to determine the “scaling factors” between the rates of change in the DC lifetests and the rates of change in the RF application. Applying these scaling factors to the original Arrhenius curves gives an “overall” Arrhenius plot for the RF application with several different lines, for the different degradation mechanisms. The technique can be extended to further degradation mechanisms, by conducting further DC and RF lifetests while monitoring appropriate signature parameters.
关键词： lifetesting,semiconductor device reliability,gallium nitride,Failure analysis,HEMTs
更新于2025-09-23 15:19:57
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[IEEE 2019 IEEE Conference on Power Electronics and Renewable Energy (CPERE) - Aswan City, Egypt (2019.10.23-2019.10.25)] 2019 IEEE Conference on Power Electronics and Renewable Energy (CPERE) - Thermal Performance Evaluation of 1500-VDC Photovoltaic Inverters Under Constant Power Generation Operation
摘要： A technique is described, to efficiently evaluate the reliability of an RF semiconductor device when several different mechanisms contribute simultaneously to its wearout. This is of interest for present-day GaN HEMT devices because symptoms of several simultaneous degradation mechanisms have been reported widely. The technique involves first finding DC parameters that are “signatures” of each mechanism. Then, separate DC-stress lifetests are performed to find the degradation rates for the signature parameters, at several temperatures, and the corresponding Arrhenius curves. Next, an RF-stress lifetest (with only one stress condition) is performed, while monitoring all of the signature parameters and the RF performance. This is utilized to determine the “scaling factors” between the rates of change in the DC lifetests and the rates of change in the RF application. Applying these scaling factors to the original Arrhenius curves gives an “overall” Arrhenius plot for the RF application with several different lines, for the different degradation mechanisms. The technique can be extended to further degradation mechanisms, by conducting further DC and RF lifetests while monitoring appropriate signature parameters.
关键词： semiconductor device reliability,lifetesting,gallium nitride,HEMTs,Failure analysis
更新于2025-09-19 17:13:59
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Microcharacterization of Interface Oxide Layer on Laser-Structured Silicon Surfaces of Plated Ni–Cu Solar Cells
摘要： Light-induced plating on laser-structured passivation layer openings is an alternative method to silver screen printing for fabrication of the front-side metal grid on silicon solar cells. Fundamental contact properties, such as adhesion and contact resistance, are determined at the highly inhomogeneous interface of laser-structured silicon and plated nickel. Usage of laser structuring and plating holds the risk that an interfacial oxide layer is incorporated to the contact stack. It is shown within this article that both native and laser-induced oxide formation influence contact properties. Although, a native oxide layer does not impede metal deposition during plating, the dynamics of the layer formation is shown to be changed. It is known that interface oxides harm the contact resistance, and it is reported that postplating annealing decreases the contact resistance. In this article, the microstructural basis of the temperature-induced changes is examined. By transmission electron microscopy and energy dispersive X-ray spectroscopy, no temperature-induced modification of the interface microstructure, such as silicide formation or metal-induced crystallization of the amorphous surface, is observed. Results suggest that the decrease is attributed to a temperature-induced change of the electrical properties of the interface oxide. Considering reports that partially closed interface oxide layers are an inherent feature of laser-structured plated contacts, the results presented motivate reconsidering the objective of postplating annealing. The results indicate that the beneficial impact of silicide formation is overrated for the case of laser-structured plated contacts, whereas the temperature-induced modifications on residual interface oxide layers are neglected in the scientific discussions on the given contact stack.
关键词： silicidation,semiconductor-metal interfaces,Photovoltaic cells,semiconductor device reliability
更新于2025-09-12 10:27:22
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[IEEE 2018 13th European Microwave Integrated Circuits Conference (EuMIC) - Madrid, Spain (2018.9.23-2018.9.25)] 2018 13th European Microwave Integrated Circuits Conference (EuMIC) - Fully Automated RF-Thermal Stress Workbench with S-Parameters Tracking for GaN Reliability Analysis
摘要： The rapid development of III-V technologies for telecommunication and radar markets need the meeting of performances (power, frequency) criteria as well as reliability assessment. Nitride HEMT technologies are known to reveal a large variety of failure electrical signatures, and it is also largely accepted that multi-tools (multi physics) approaches is the only suitable way to understand the failure mechanisms and to improve the technologies. Experimental stress workbenches usually allow to track a given number of static/dynamic parameters, but specific characterization are only performed at initial and final steps on the devices. This paper proposes a new approach with S-parameters measurement performed during RF stresses without removing the devices under test (in a thermally controlled oven). Then intermediate knowledge of the electrical (small signal) behavior of the devices can be assessed, and crossed with large-signal and static time-dependent signatures.
关键词： Microwave transistors,HEMTs,Gallium nitride,Life testing,C-band,Semiconductor device reliability
更新于2025-09-04 15:30:14