- 标题
- 摘要
- 关键词
- 实验方案
- 产品
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Numerical study of comb-based high-accuracy distance measurement utilizing VIPA interferometry
摘要： The ultrahigh-precision distance measurement based on a single laser frequency comb as the multi-wavelength source together with an ultra-high-resolution dispersive spectrometer utilizing a virtually imaged phase array (VIPA) was studied numerically. The simulations provide the component parameter optimization and the comb spectral images on a CCD camera. An ameliorated scheme was proposed through achieving real-time comparisons between the reference and interference signals captured on a camera simultaneously to improve both the measurement accuracy and the precision signi?cantly. With the optimized data processing, the proposed approach is especially suitable for serving as a ultra-high precision relative distance measurement, and the measurement resolution can reach picometer scale in the optimal cases.
关键词： Ultra-high precision distance measurement,Ultra-high resolution spectroscopy,Laser frequency comb,Virtually imaged phase array interferometry
更新于2025-09-19 17:15:36
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8.3: <i>Invited Paper:</i> Ultra High Resolution Display for Digital Holography
摘要： Ultra high resolution display panels are one of the technical trends for future display and essential for the realization of digital hologram. Two approaches for the development toward 1um pixel pitch are introduced. SLM panel with 3μm pixel pitch based on reflected TFT-LCD was fabricated. Reconstructed hologram images were successfully demonstrated. SLM based on phase change materials was under development. In this case the driving circuitry was consist of Si CMOS backplane. Due to the scalability of PCM materials, accomplishment of pixel pitch with 1μm is very promising.
关键词： TFT-LCD,Spatial Light Modulator,Ultra high resolution,Holography,Phase modulation,Active-matrix displays,TFTs,Phase Change Materials
更新于2025-09-12 10:27:22
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Strategy toward ultra-high-resolution micro-LED displays by bonding interface-engineered vertical stacking and surface passivation
摘要： In this paper, we have proposed the strategy to fulfill the vertically stacked subpixel (VSS) micro-light-emitting diodes (μ-LEDs) for future ultra-high resolution microdisplays. At first, to vertically stack the LED with different colors, we have successfully adopted the bonding interface engineered monolithic integration method by using SiO2/SiNx distributed Bragg reflectors (DBRs). It was found that an intermediate DBR structure can be performed as the bonding layer and the color filter, which can reflect and transmit desired wavelengths the bonding interface. Furthermore, the optically pumped μ-LEDs array with 0.4 μm pitch corresponding to ultra-high-resolution of 63500 PPI was successfully fabricated by using typical semiconductor processing, including electron-beam lithography. Compared with pick-and-place with the limitation of the machine alignment accuracy, there is a significant improvement for fabricating the high-density μ-LEDs. Finally, we have systematically investigated the effects of surface traps by using time-resolved photoluminescence (TRPL) and two-dimensional simulation. These results clearly demonstrated that performance improvements could be possible by employing the optimal passivation techniques according to diminishing the pixel size for low power and highly-efficient microdisplays.
关键词： ultra-high-resolution,micro-LEDs,wafer bonding,distributed Bragg reflectors,surface passivation
更新于2025-09-11 14:15:04