研究目的
To investigate the surface roughening of silicon wafer solar cells using electrochemical discharge machining (ECDM) to enhance light absorption and reduce reflectance, thereby improving solar cell efficiency.
研究成果
ECDM effectively increases surface roughness and reduces reflectance of silicon wafers, enhancing solar cell efficiency. Optimal parameters include a 200μm gap, 48V voltage, 3M KOH, and 4% ethanol, achieving significant improvements in a short processing time.
研究不足
The study is limited to mono-crystalline silicon wafers and specific ECDM parameters. The effects of varying other materials or conditions are not explored.
1:Experimental Design and Method Selection:
The study employs ECDM for surface texturing of silicon wafers, utilizing stainless steel and graphite electrodes with potassium hydroxide as the electrolyte. Parameters like voltage, time, gap, concentration, and pulse settings are varied.
2:Sample Selection and Data Sources:
P-type mono-crystalline silicon wafers of specific dimensions are used. Surface roughness and reflectance are measured post-processing.
3:List of Experimental Equipment and Materials:
Includes a micro ECDM system, stainless steel and graphite electrodes, potassium hydroxide, ethanol, and measurement instruments like SEM and reflectometer.
4:Experimental Procedures and Operational Workflow:
Involves setting up the ECDM system, adjusting parameters, processing the silicon wafers, and analyzing the results through surface roughness and reflectance measurements.
5:Data Analysis Methods:
Analysis of surface roughness and reflectance data to determine the optimal processing parameters for enhancing solar cell efficiency.
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stainless steel electrode
Used as the cathode in the ECDM process to produce sparkle discharging reaction.
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graphite electrode
Acts as the auxiliary anode in the ECDM process to form a complete discharging loop.
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potassium hydroxide
Used as the electrolyte in the ECDM process to facilitate electrochemical reaction.
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ethanol
Additive in the electrolyte to accelerate hydrogen and oxygen escape from silicon surface, increasing reaction rate and etching uniformity.
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peristatic pump
Used to cycle the electrolyte during the ECDM process.
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2D surface roughness measurement instrument
Used to measure the surface roughness of the silicon wafers post-processing.
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scanning electron microscope
SEM
Used to observe the surface morphologies of the processed silicon wafers.
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integration spectroscopic reflectometer
Used to measure the reflectance rate of the silicon wafers before and after ECDM processing.
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