研究目的
Investigating whether merely substrate temperature dependent surface mechanisms and plasma particle diffusion are sufficient to theoretically obtain anisotropic etching during black silicon preparation by maskless SF6/O2 plasma texturing.
研究成果
The study concludes that a b-Si formation or at least an initial roughening with small wavelength can be explained by plasma etching through a temperature dependent amplification factor without taking into account the influence of ions. However, ions are assumed to play a major role during the development of the final texture forms.
研究不足
The model does not take into account the influence of ions during the texturing process, which is presumed to play a major role during the development of the final texture forms. Further investigations, such as numerical calculations of the surface development, are suggested for a more comprehensive evaluation.
1:Experimental Design and Method Selection:
A quasi-2D model is developed including the relevant mechanisms such as etching, the deposition of the masking layer SiOxFy, plasma particle transport, and heat diffusion. A linear stability analysis is applied to reveal theoretical conditions for anisotropic etching and to evaluate the impact of the model parameters on the texturing range.
2:Sample Selection and Data Sources:
The study considers a silicon wafer with a thin SiOxFy layer on top of the surface as the initial state.
3:List of Experimental Equipment and Materials:
Not explicitly mentioned in the provided text.
4:Experimental Procedures and Operational Workflow:
The model is solved numerically using the classical Runge-Kutta method to illustrate the time dependence of the parameters at an arbitrary position of the surface.
5:Data Analysis Methods:
A linear stability analysis is applied to identify texture formation regimes in dependence on the structure length of the textures.
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