研究目的
To present high-performance vertical van der Waals heterostructure-based photodetectors integrated on a silicon photonics platform, addressing the challenge of intrinsically small carrier mobilities of TMDCs for high-speed applications.
研究成果
The study demonstrates that the combination of two-dimensional heterostructures and integrated guided-wave nano photonics is a viable platform for high-performance optoelectronic devices, achieving record-high bandwidths and high responsivity for photodetectors at telecom wavelengths.
研究不足
The study is limited by the intrinsic material constraints of TMDCs, such as small carrier mobilities, and the technical challenges of integrating TMDCs with silicon-based structures.
1:Experimental Design and Method Selection:
The study employs a vertical MoTe2–graphene heterostructure design integrated with planar silicon photonic waveguides to minimize carrier transit path length in TMDCs.
2:Sample Selection and Data Sources:
Mechanical exfoliation was used to obtain crystalline flakes of MoTe2, graphene, and hexagonal boron nitride (hBN).
3:List of Experimental Equipment and Materials:
Silicon-on-insulator (SOI) wafers, atomic layer deposition for SiN dielectric layer, electron-beam lithography for metallic pads, and a polymer-based pick-up technique for stacking flakes.
4:Experimental Procedures and Operational Workflow:
Fabrication involved creating buried silicon waveguides, stacking graphene and MoTe2 flakes, forming top Au contact pads, and encapsulating with hBN flakes. Measurements were performed at ambient conditions.
5:Data Analysis Methods:
Electrical characterization was performed using a pico-ampere precision source. High-frequency measurements were done using an optical intensity Mach–Zehnder modulator and an electrical spectrum analyser.
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SUSS MJB4 mask aligner
MJB4
SUSS
Used for aligning the stacked flakes to the silicon waveguides.
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silicon-on-insulator (SOI) wafers
Used as the substrate for fabricating the photodetectors.
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atomic layer deposition
Used for depositing a top 5-nm-thick SiN dielectric layer.
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electron-beam lithography
Used for defining bottom metallic pads and forming top Au contact pads.
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polydimethylsiloxane (PDMS) polypropylene carbonate (PPC) stamp
Used for stacking graphene and MoTe2 flakes.
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pico-ampere precision source
Used for electrical characterization.
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optical intensity Mach–Zehnder modulator
MZMO2120
Used for modulating an amplified continuous-wave laser.
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electrical spectrum analyser
Used for measuring the generated RF electrical signals.
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high-speed photodetector
XPDV3120R
Used for calibrating the measurement setup.
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