研究目的
To improve the reliability and lifetime of IGBT power modules by optimizing their physical structure considering both power cycling and thermal cycling effects.
研究成果
The paper presents a novel and efficient method for optimizing the structure of power electronic modules, particularly under specific environmental and operational conditions. It demonstrates that multiobjective optimization considering both power cycling and thermal cycling effects is necessary due to their conflicting impacts on module reliability. The approach effectively identifies Pareto-optimal solutions, offering a way to balance competing objectives in module design.
研究不足
The study is limited to the optimization of IGBT modules' physical structure under specific thermal and power cycling conditions. It does not address all possible failure mechanisms or the impact of manufacturing defects and process variations.
1：Experimental Design and Method Selection:
The study employs a multiobjective optimization strategy combining analytical thermal resistance calculation and high-fidelity finite-element modeling validated experimentally.
2：Sample Selection and Data Sources:
The study focuses on standard IGBT modules, with data derived from both simulations and experimental validations.
3：List of Experimental Equipment and Materials:
Utilizes finite-element analysis software (Ansys
4：5) and validated experimental setups for thermal and power cycling tests. Experimental Procedures and Operational Workflow:
Involves iterative calculation of thermal resistance and plastic work, formulation of objectives via surrogate modeling, and optimization using the NSGA-II algorithm.
5：Data Analysis Methods:
Analysis includes thermal resistance calculation, plastic work estimation via finite-element analysis, and multiobjective optimization to identify Pareto-optimal solutions.
独家科研数据包，助您复现前沿成果，加速创新突破
获取完整内容
