研究目的
To demonstrate a recent advance in laser zone annealing, which utilizes a powerful fiber-coupled near-IR laser source allowing rapid BCP annealing over a large area on conventional silicon wafers, and to report a facile method of transferring laser-annealed BCP films onto arbitrary surfaces.
研究成果
The study demonstrates a facile way of obtaining large area uniaxially-aligned cylindrical PS-b-P2VP BCP films on silicon substrates by cold-zone laser annealing coupled to soft shearing. The method utilizes an industrial-grade diode laser, making it an economical alternative to research-grade laser sources. The ability to transfer aligned BCP films onto arbitrary substrates opens new possibilities for patterning complex BCP motifs on various surfaces.
研究不足
The technique is limited by the thermal properties of silicon, which requires careful thermal grounding to prevent thermal run-aways. Additionally, the method may encounter issues with PDMS delamination from the BCP surface during soft-shearing experiments under high-power processing conditions.