研究目的
To present a method for quantifying a risk for killer defects at layer level and estimating yield for substrate packages using information from design files.
研究成果
The method of quantifying layer level risks using the risk distance metric is presented. The layer level risk rank is compared with baseline yield, showing an inverse correlation. The yield model is validated using killer defect PDF from baseline lots, matching with actual yield for different layers. Estimated yield for a second design is compared with actual yield, showing a correlation within less than 1% yield difference.
研究不足
The study focuses on short killer defects, and the same concept should be able to apply for open killer defects as well. The killer defect PDF remains the same between designs for yield estimation.
