研究目的
Investigating the use of infrared cameras for temperature measurement of small components in electronics development to address heating issues caused by increasing packing density and miniaturization.
研究成果
Infrared cameras are essential tools in electronics development for measuring temperatures of miniaturized components, identifying design errors, and ensuring quality control. High-resolution cameras with suitable lenses provide reliable temperature data, aiding in quicker and safer electronics development.
研究不足
The resolution and accuracy of temperature measurement are dependent on the pixel count and size of the bolometers, as well as the lens quality. Small objects may not be accurately measured if they cover too few pixels.
