研究目的
Investigating the role of various reactive gases on the structure and properties of TiN thin films prepared by plasma enhanced atomic layer deposition (PEALD).
研究成果
The study demonstrated that the choice of reactive gas significantly affects the structure, composition, and properties of TiN films deposited by PEALD. NH3 plasma resulted in the lowest resistivity and stoichiometric films, while H2 plasma led to higher contamination levels. The reactive gas also influenced the grain size and preferential orientation of the films. The findings suggest that minimizing plasma gas pressure is critical for achieving low film resistivity, especially with hydrogen-based plasmas.
研究不足
The study is limited by the specific conditions of the PEALD process and the types of reactive gases used. The potential for plasma-induced damage to underlying layers was noted, particularly with hydrogen-based plasmas.
1:Experimental Design and Method Selection:
The study employed plasma enhanced atomic layer deposition (PEALD) using tetrakis(dimethylamido) titanium as the precursor and various reactive gases (N2, NH3, H2, and N2/H2 mixture). The deposition parameters included plasma power, pulse periods, and deposition temperature.
2:Sample Selection and Data Sources:
TiN films were deposited on SiO2/Si substrates. The films' properties were analyzed using X-ray reflectivity (XRR), X-ray diffraction (XRD), transmission electron microscopy (TEM), and X-ray photoelectron spectroscopy (XPS).
3:List of Experimental Equipment and Materials:
Ultratech/Cambridge Nanotech Fiji G2 PEALD system, Rikagu SmartLab 9 kW system for XRD, PHI VersaProbe III system for XPS, Titan Themis G2 for TEM.
4:Experimental Procedures and Operational Workflow:
Films were deposited under varying plasma conditions, followed by characterization of their structural, compositional, and electrical properties.
5:Data Analysis Methods:
The data were analyzed to determine film thickness, crystal structure, elemental composition, and resistivity.
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