研究目的
Investigating the fabrication of flexible interlayer dielectrics (ILDs) films with a low dielectric constant, excellent mechanical characteristics, and thermal properties in foldable organic light emitting diodes (OLEDs) using inkjet printing of SiO2 hollow spheres (SHSs)/polyimide (PI) hybrid films.
研究成果
The inkjet printing of SHSs/PI hybrid films is a promising method for creating flexible ILDs with low dielectric constants, excellent mechanical and thermal properties, suitable for foldable OLEDs. The films maintained their dielectric constant and current density after extensive bending, indicating their potential for flexible electronic applications.
研究不足
The study does not address the solvent adsorption into the pore and breaking of the shell while hollow spheres mix with PI, which could affect the film's performance. Additionally, the electrical properties after bending tests were not extensively studied in previous works.
1：Experimental Design and Method Selection:
The study utilized inkjet printing for fabricating SHSs/PI hybrid films, employing SiO2 coated polystyrene (PS) ink and PI ink.
2：Sample Selection and Data Sources:
PS beads were synthesized via surfactant-free emulsion polymerization, and SiO2 coated PS particles were fabricated using the modified St?ber method.
3：List of Experimental Equipment and Materials:
Equipment included a UJ 200 inkjet printing unit, FE-SEM for characterization, and a Keithley 4200-SCS electrometer for electrical measurements. Materials included styrene monomer, PVP, AIBA, TEOS, and DMF.
4：Experimental Procedures and Operational Workflow:
The process involved synthesizing PS beads, coating them with SiO2, preparing inks, inkjet printing, and thermal treatment to form SHSs/PI hybrid films.
5：Data Analysis Methods:
Electrical properties were measured using I-V and C-V characteristics, and mechanical properties were assessed through bending tests.
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