研究目的
To propose a generic process for manufacturing a flexible label that integrates silicon components such as ASIC, sensor or actuator, and to evaluate two approaches for this integration.
研究成果
The study successfully demonstrated the feasibility of interconnecting silicon bare dies on a PEN film using gold stud-bumps and silver bumps, with high interconnection yields for dies of 720μm thickness. For thinned dies, improvements in the bonding process are necessary. The second approach, integrating dies into a polymer film, showed promising results with successful peel-off and encapsulation of thinned silicon chips, paving the way for flexible electronic systems.
研究不足
The bonding process for thinned dies (300μm) showed failures in the center of the chip, indicating a need for process optimization. The study also notes the need for further investigation into the homogeneous application of force during assembly.
1：Experimental Design and Method Selection:
The study evaluates two approaches for integrating silicon bare dies into flexible layers: hybridization onto a Polyethylene-Naphthalate (PEN) film and integration into a thin polymer layer on a temporary wafer substrate. Both approaches use flip-chip hybridization with gold stud-bumps for electrical interconnection.
2：Sample Selection and Data Sources:
Silicon test vehicles were developed to simulate bare dies. PEN films and polymer layers (SiNR) were used as flexible substrates.
3：List of Experimental Equipment and Materials:
Standard ball bumping equipment for gold stud-bumps, flip-chip tool for alignment and attachment, photolithography and etching processes for patterning, and serigraphy for silver ink deposition.
4：Experimental Procedures and Operational Workflow:
Silicon dies were aligned and attached on PEN using a flip-chip tool with a combination of heat and pressure. For the polymer integration approach, dies were thinned collectively at the wafer level and encapsulated in SiNR before peel-off from the temporary substrate.
5：Data Analysis Methods:
Electrical continuity through daisy chains was tested using probes to evaluate interconnection yield.
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