研究目的
To develop a reliable, fast, and non-destructive analysis tool for monitoring water ingress into the encapsulation of electronic devices, especially for organic and perovskite-based electronics, to guide the development of suitable barrier materials and design.
研究成果
The developed IR absorption imaging method offers a nondestructive way to monitor water ingress into the packaging of electronic devices, providing quantitative data on water concentration as a function of time and space. It allows for the identification of moisture ingress pathways and the determination of diffusion coefficients, facilitating the optimization of packaging materials, processes, and geometries to enhance device lifetimes.
研究不足
The method's detection limit is currently at 0.6 g/m2, with potential to reach below 10 mg/m2 for packaging materials transmissive around 2940 nm. The technique requires careful correction for changing background absorption caused by ageing of the package.
1:Experimental Design and Method Selection:
An imaging setup based on selective infrared (IR) radiation sources and a mid-IR sensitive camera was used to monitor the distribution of water concentration inside the packaging of devices and its change over time. The system utilizes the absorption band of water around 1920 nm and a reference band.
2:Sample Selection and Data Sources:
Glass was used as a barrier material, with water ingress through the adhesive as the only path of water ingress into the device. Samples were exposed to damp heat conditions (85 °C and 85% relative humidity) according to the stability testing protocol ISOS-D-
3:List of Experimental Equipment and Materials:
Equipment included a dispensing robot for encapsulation process, UV light for curing, a profilometer for thickness measurement, a broadband spectrometer for spectral measurements, damp heat chambers for controlled exposure, a high-precision weighing scale for gravimetric measurements, and an IR absorption imaging setup with components like gray body radiators, optical diffusor, multi-reflection mirror tube, NIR objective, optical bandpass filters, and a mid IR camera.
4:Experimental Procedures and Operational Workflow:
The encapsulation process involved distributing epoxy adhesive over a top barrier sheet, adding a bottom barrier sheet, and curing under UV light. Samples were then exposed to damp heat conditions, and IR absorption images were taken before and after exposure to monitor water ingress.
5:Data Analysis Methods:
The optical density image (ODI) of the sample was calculated from the raw images, and changes in optical density due to water uptake were analyzed. FEM simulations were performed to compare with experimental data and determine the diffusion coefficient of water.
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UV light
UV-cube 100
H¨onle
Used for curing the epoxy adhesive
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broadband spectrometer
Lambda 950
Perkin Elmer
Conducts spectral measurements
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gray body radiators
HWK-IR-Si311-P-3
Laser 2000
Emit wavelengths in a wide range for the IR absorption imaging setup
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optical bandpass filter
1950 nm
Spectrogon
Lets only wavelengths within the absorption band of water reach the detector
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IR cuvette
CV10Q3500S 3500 μl macro cuvette with stopper
Thorlabs
Used for analyzing water-acetone mixtures in the IR absorption imaging setup
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dispensing robot
I&J 4100-LF
Fisnar
Distributes the epoxy adhesive homogenously over the top barrier sheet
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epoxy adhesive
Katiobond LP655
DELO
Used for lamination in the encapsulation process
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profilometer
Alpha-Step D-100 Stylus Profiler
KLA-Tencor
Measures the thickness of the cured layer of adhesive
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damp heat chambers
climate test cabinet
CTS
Ensures controlled exposure to heat and humidity
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weighing scale
R180 D
Sartorius GmbH
Used for gravimetric measurements
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NIR objective
Helios 44M 7
Zenit
Helps to cut off unwanted radiation in the MIR region
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MIR camera
Equus 327kNM
IRcam
Detects the IR absorption for imaging
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mechanical shutter
CS45 45 mm uni-stable shutter and VCM-D1 shutter driver
Vincent associates
Used to take a dark image for correcting the actual signal image
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