1：Experimental Design and Method Selection:

The study involved depositing 9 nm copper films on glass or PET substrates using thermal evaporation, followed by passivation with a 0.8 nm aluminium layer. The effectiveness was evaluated through sheet resistance measurements, AFM, STEM, EDXS, and XPS analyses to understand the passivation mechanism.

2：8 nm aluminium layer. The effectiveness was evaluated through sheet resistance measurements, AFM, STEM, EDXS, and XPS analyses to understand the passivation mechanism. Sample Selection and Data Sources:

2. Sample Selection and Data Sources: Glass microscope slides and PET substrates were used, cleaned and treated with UV/O3. Copper and aluminium films were deposited under high vacuum conditions (<5×10^{-8} mbar).

3：Copper and aluminium films were deposited under high vacuum conditions (<5×10^{-8} mbar). List of Experimental Equipment and Materials:

3. List of Experimental Equipment and Materials: Equipment included a thermal evaporator (Kurt J. Lesker SPECTROS system), AFM (Asylum Research MFP-3D), STEM (JEOL ARM200F), XPS (Kratos Axis Ultra DLD), and photolithography tools. Materials included copper, aluminium, alkylsilane adhesion layers, and photoresists.

4：Experimental Procedures and Operational Workflow:

Substrates were cleaned, treated, and metal films deposited. Sheet resistance was measured over time in ambient air. AFM, STEM, and XPS were used for surface and compositional analysis. Lithographic patterning was performed to create apertures.

5：Data Analysis Methods:

Sheet resistance data were analyzed using the Van der Pauw method. AFM images were used to calculate surface roughness. STEM and EDXS provided elemental mapping. XPS data were analyzed with CasaXPS software for chemical state analysis.