研究目的
Investigating the effects of solvent properties and substrate surface energy on the crystallization kinetics and morphology of P3HT:PCBM thin films during solvent vapor annealing using in-situ GIWAXS.
研究成果
Solvent vapor annealing significantly influences the crystallization and morphology of P3HT:PCBM films, with solvent properties (vapor pressure and solubility) and substrate surface energy being key factors. THF induces unique, highly ordered PCBM crystallization, while CS2 leads to low crystallinity due to rapid evaporation. Annealing generally increases P3HT conjugation length and enriches the air surface with PCBM, impacting potential device performance.
研究不足
The study is limited to specific solvents and substrates; effects of controlled partial solvent pressure were not explored. The complexity of multi-phase systems may complicate interpretation of results. In-situ measurements are constrained by equipment sensitivity and time resolution.
1:Experimental Design and Method Selection:
The study used in-situ grazing incidence wide-angle X-ray scattering (GIWAXS) to monitor real-time crystallization and dissolution of P3HT and PCBM in thin films during solvent vapor annealing (SVA) with various solvents and substrates of different surface energies.
2:Sample Selection and Data Sources:
P3HT:PCBM blend films were spin-coated on silicon substrates with and without self-assembled monolayer (SAM) coatings to vary surface energy. Solvents used included o-dichlorobenzene, o-xylene, tetrahydrothiophene, toluene, benzene, tetrahydrofuran, and carbon disulfide.
3:List of Experimental Equipment and Materials:
Equipment included a GIWAXS setup at Cornell High Energy Synchrotron Source (CHESS), atomic force microscope (AFM, Dimension Icon by Bruker), UV-Vis spectrometer, XPS (PHI VersaProbe II), and contact angle goniometer (Ramé-hart). Materials included P3HT (Rieke Metals, Inc.), PCBM (nano-c, Inc.), silicon wafers (Silicon Quest International, Inc.), and solvents.
4:Experimental Procedures and Operational Workflow:
Films were annealed in a closed chamber saturated with solvent vapor for 20 minutes, followed by drying for 20 minutes. GIWAXS images were captured every few seconds. Post-annealing, films were characterized with AFM, UV-Vis, and XPS.
5:Data Analysis Methods:
GIWAXS data were processed using MATLAB code for scattering volume analysis. Peak intensities, d-spacings, and full-width half max (FWHM) were calculated using OriginPro software. AFM images were analyzed for roughness and topography, and XPS data were processed with PHI MultiPak software.
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Atomic Force Microscope
Dimension Icon
Bruker Corporation
Measuring film thickness and surface roughness, topographic imaging
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XPS Microprobe
PHI VersaProbe II
PHI
Determining top surface composition of films
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Goniometer
Ramé-hart advanced
Ramé-hart
Measuring contact angles for surface energy calculation
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UVO Chamber
PSD series
Novascan
Cleaning silicon substrates with UV ozone
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Silicon Wafer
0.5 mm thick
Silicon Quest International, Inc.
Substrate for film deposition
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P3HT
#4002-EE
Rieke Metals, Inc.
Electron donor material in blend films
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PCBM
99.5% pure
nano-c, Inc.
Electron acceptor material in blend films
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Solvent
o-dichlorobenzene
VWR
Annealing solvent
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