研究目的
To investigate the properties of the MLCC chips for high-temperature stability and energy storage applications.
研究成果
BTBNT-based MLCC chips with a core-shell structure exhibit excellent temperature stability meeting X9R specifications and high energy storage performance, with a discharge energy density of 3.33 J/cm3 and efficiency over 80% at high temperatures, making them promising for high-temperature energy storage applications.
研究不足
The study is limited to a specific composition (BTBNT with Nb and Mn dopants) and a ten-layer MLCC structure. The temperature range tested is up to 500°C, but long-term stability or other environmental factors are not addressed. The efficiency decreases at higher electric fields and temperatures, indicating potential issues for extreme conditions.
1:Experimental Design and Method Selection:
The study uses a roll-to-roll tape casting method for preparing MLCC chips, with two-step sintering (TSS) to achieve low-temperature sintering. X-ray diffraction (XRD), transmission electron microscopy (TEM), Raman spectroscopy, and electrical property measurements are employed to characterize the structure and properties.
2:Sample Selection and Data Sources:
Samples are BTBNT-based MLCC chips with ten dielectric layers, prepared from BaTiO3 and (Bi0.5Na0.5)TiO3 powders doped with Nb2O5 and MnO2. Data are collected from laboratory experiments.
3:5Na5)TiO3 powders doped with Nb2O5 and MnOData are collected from laboratory experiments. List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: Equipment includes a test coater for tape casting, automated printing and stacking machines, XRD with temperature controller, TEM, Raman spectrometer, impedance analyzer, and ferroelectric tester. Materials include BaTiO3 powder, Bi2O3, Na2CO3, TiO2, Nb2O5, MnO2, solvents, dispersants, binders, plasticizers, and Ag/Pd paste.
4:Experimental Procedures and Operational Workflow:
Powders are prepared by solid-state reaction and sand milling. Slurry is cast into green tapes, electrodes are screen-printed, layers are stacked, and chips are sintered using TSS. Structural and electrical properties are measured at various temperatures.
5:Data Analysis Methods:
XRD and TEM data are analyzed for phase identification and microstructure. Electrical data are analyzed using impedance measurements and polarization-electric field loops to calculate energy storage density and efficiency.
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X-ray diffraction
SmartLab
Rigaku
Characterize crystalline structures of samples with temperature control.
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Transmission electron microscope
JEM-2010F
JEOL Ltd.
Detect microstructure and core-shell structure of ceramic grains.
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Raman spectrometer
HR800
HORIBA JobinYvon
Record Raman spectra at different temperatures.
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Impedance analyzer
E4980A
Agilent Technologies Inc.
Measure dielectric properties from -100°C to 250°C.
E4980A/E4980AL Precision LCR Meter
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Automated printing machine
NPM-1Y01
Yodogawa NCC Co., Ltd.
Screen print Ag0.6/Pd0.4 paste for inner electrodes.
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Automated stacking machine
NSM-1Y01
Yodogawa NCC Co., Ltd.
Stack ten-layer capacitors.
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TF analyzer
2000E
AixACCT Systems Inc.
Measure ferroelectric hysteresis loops with a furnace.
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Test coater
CMD-S1.7/D/4.OH/3-778
Yasui Seiki Co.
Prepare green tape via roll-to-roll casting method.
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