研究目的
To determine the effects of the IC-PCB interface (ICPB), consisting of contact pads on IC chip die, bondwires and package body terminals, on the parameters of submicron IC.
研究成果
The developed equivalent circuits adequately represent the ICPB interface, allowing for accurate prediction of device parameters and enabling correction of matching circuits. Direct placement of IC die on PCB is optimal, while large packages with long terminals lead to significant degradation in LNA performance. The technique supports high-frequency device development by facilitating package selection and circuit design adjustments.
研究不足
The study ignored magnetic coupling effects between adjacent bondwires, which could affect accuracy. The models assume idealized conditions and may not account for all real-world variations in manufacturing. The frequency range is focused on GPS applications (1.575 GHz), limiting generalizability to higher frequencies. Skin effect calculations are approximate and depend on material properties.
1：Experimental Design and Method Selection:
The study involved developing and verifying models of the ICPB interface for different package types, using equivalent circuits to represent the interface elements. Theoretical models and equations were employed for parameter calculations, such as inductance and resistance based on geometry and material properties.
2：Sample Selection and Data Sources:
The LNA module from a GPS receiver test chip fabricated in
3：13 μm CMOS technology was used as the sample. Package types included CLCC 48, LCCC H48, and QFN-List of Experimental Equipment and Materials:
Equipment included a Vector Network Analyzer (R&S ZVL) for measurements. Materials involved gold bondwires of various diameters (18-100 μm), IC die with contact pads, and different package types.
4：Experimental Procedures and Operational Workflow:
Parameters of ICPB units (contact pads, bondwires, package body terminals) were calculated using geometric data and equations. Simulations were performed to estimate LNA parameters under different interface configurations. Measurements were conducted using the network analyzer to verify the models, with impedance matching using external elements.
5：Data Analysis Methods:
Data analysis involved comparing simulated and measured parameters (e.g., S21, NF, S11, S22) using Smith diagrams and tabulated results. Statistical comparisons were made to assess accuracy.
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