研究目的
To develop a novel seed layer for transparent copper films that improves oxidation stability and reduces the percolation threshold, serving as a low-cost alternative to silver for optoelectronic applications.
研究成果
The hybrid nucleation layer significantly enhances the oxidation stability and reduces the percolation threshold of transparent copper films, making them comparable to silver films. This is attributed to increased Cu crystallite size, which reduces grain boundary density and susceptibility to oxidation. The findings suggest potential for low-cost, stable transparent electrodes in optoelectronic devices, with recommendations for further optimization and scaling.
研究不足
The study is limited to specific substrates (glass and PET) and may not generalize to other materials. The hybrid layer's effectiveness relies on precise deposition conditions, which could be challenging to scale. Long-term stability beyond 400 hours is not fully explored, and environmental factors like humidity and temperature fluctuations during testing may affect results.
1:Experimental Design and Method Selection:
The study involves designing a hybrid nucleation layer composed of a mixed molecular monolayer (MPTMS and APTMS) and an ultra-thin aluminium layer (0.8 nm) deposited via vapour phase methods. The rationale is to enhance film formation and stability by suppressing metal atom diffusion and reducing oxidation. Theoretical models include SAXS for crystallite size analysis and XPS for surface composition.
2:8 nm) deposited via vapour phase methods. The rationale is to enhance film formation and stability by suppressing metal atom diffusion and reducing oxidation. Theoretical models include SAXS for crystallite size analysis and XPS for surface composition. Sample Selection and Data Sources:
2. Sample Selection and Data Sources: Substrates used are glass microscope slides (7525 M, J. Melvin Freed Brand) and PET. Samples are cleaned ultrasonically with Hellmanex III surfactant, deionized water, and propan-2-ol, followed by UV/O3 treatment. Data sources include sheet resistance measurements, UV-vis spectra, AFM, XPS, TEM, and SAXS.
3:List of Experimental Equipment and Materials:
Equipment includes a vacuum evaporator (customized SPECTROS system with N2 glovebox, Kurt J. Lesker), AFM (Asylum Research MFP-3D), UV-vis spectrophotometer (PerkinElmer Lambda 1050), XPS spectrometer (Kratos Axis Ultra DLD), TEM (Jeol 2100 LaB6), and SAXS setup (Xenocs Xeuss 2.0 with Pilatus 300k detector). Materials include MPTMS, APTMS, aluminium, copper, silver, PEI, and various chemicals for cleaning.
4:0 with Pilatus 300k detector). Materials include MPTMS, APTMS, aluminium, copper, silver, PEI, and various chemicals for cleaning. Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: Substrates are cleaned and treated with UV/O3. Mixed molecular monolayers are deposited in a desiccator at reduced pressure. Al, Cu, or Ag layers are evaporated in vacuum at specified rates. Sheet resistance is measured using a Keithley 2400 source meter with Van der Pauw method. Samples are stored in ambient air for oxidation studies. AFM, XPS, TEM, and SAXS analyses are performed as per standard protocols.
5:Mixed molecular monolayers are deposited in a desiccator at reduced pressure. Al, Cu, or Ag layers are evaporated in vacuum at specified rates. Sheet resistance is measured using a Keithley 2400 source meter with Van der Pauw method. Samples are stored in ambient air for oxidation studies. AFM, XPS, TEM, and SAXS analyses are performed as per standard protocols. Data Analysis Methods:
5. Data Analysis Methods: Data analysis includes fitting SAXS data using Irena package for crystallite size distribution, XPS data analysis with CasaXPS package using Shirley backgrounds and Voigt lineshapes, and statistical analysis of AFM roughness and sheet resistance trends.
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UV-vis spectrophotometer
Lambda 1050
PerkinElmer
UV-visible spectroscopy for transmittance and reflectivity measurements.
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XPS spectrometer
Axis Ultra DLD
Kratos
X-ray photoelectron spectroscopy for surface compositional and chemical state analysis.
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TEM
2100 LaB6
Jeol
Transmission electron microscopy for imaging film morphology.
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Source meter
2400
Keithley
Measuring sheet resistance using Van der Pauw method.
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SPECTROS system
Customised with N2 glovebox
Kurt J. Lesker
Vacuum evaporation system for depositing metal layers.
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AFM
MFP-3D
Asylum Research
Atomic force microscopy for surface roughness measurements and thickness calibration.
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SAXS setup
Xeuss 2.0
Xenocs
Small-angle X-ray scattering for crystallite size analysis.
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Glass microscope slides
7525 M
J. Melvin Freed Brand
Substrate for film deposition.
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Surfactant
Hellmanex III
Hellma Analytics
Cleaning agent for substrates.
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