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Homogeneous Anodic TiO <sub/>2</sub> Nanotube Layers on Ti–6Al–4V Alloy with Improved Adhesion Strength and Corrosion Resistance
摘要： Hexagonal TiO2 nanotubes (TNTs) arrays are generally fabricated on Ti-based substrates for some biomedical purposes, but the TNT layers constructed on conventionally processed Ti alloys are usually inhomogeneous because the substrates typically contain both the α and β phases. In this work, high-pressure torsion (HPT) is applied to obtain a saturated single α-phase microstructure in Ti–6Al–4V alloys via strain-induced β phase dissolution. Homogeneous anodic TNT layers with three different morphologies, one-step nanoporous, one-step nanotubular, and two-step nanoporous structures, are electrochemically fabricated on the ultrafine-grained (UFG) Ti–6Al–4V alloy substrates after HPT processing, whereas the TNT layers prepared on coarse-grained substrates are normally inhomogeneous. More notably, the TNT layers show significantly improved adhesion strength to the UFG substrate as well as better corrosion resistance compared to those on the conventionally processed Ti–6Al–4V substrates. X-ray diffraction analysis, scanning electron microscopy in combination with electron backscatter diffraction, and transmission electron microscopy indicate that the improvement is due to a larger dislocation density in the UFG substrate as well as strain-induced β phase dissolution.
关键词： high-pressure torsion,homogeneity,TiO2 nanotubes,adhesion strength,strain-induced phase transformation
更新于2025-11-21 11:03:13
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Investigation of nanomechanical and adhesion behavior for AlN coating and AlN/Fe2-3N composite coatings created by Active Screen Plasma Nitriding on Al 1050
摘要： This study investigated the effect of nitriding time and temperature on the mechanical properties of the composite AlN/Fe2-3N coating deposited on the pure aluminium substrate using the novel Active Screen Plasma Nitriding (ASPN) method. ASPN treatment was performed for 2, 5, 10, 15 h at temperatures of 450,500, and 550 (cid:1)C and Conventional Plasma Nitriding (CPN) treatment was carried out for 5 h at 500 (cid:1)C. All treatments were performed at the 10 KHz frequency with 80% duty cycle on the Al1050 substrate under 20%H2t80%N2 atmosphere. Phase and microstructure studies were performed using, respectively, the grazing incidence x-ray diffraction (GIXRD) system and the ?eld emission - scanning electron microscopy (FE-SEM) system equipped with energy-dispersive spectroscopy (EDS) analyzer. The mechanical strength of the coating was evaluated by the roughness, nano-hardness, nano-scratch, and adhesion strength tests performed on coated and uncoated specimens. According to the results, the uncoated Al1050 specimen, the CPN-treated specimen, and the ASPN-treated specimen had a mean nano-hardness of 0.7 ± 0.1 GPa, 10.9 ± 0.6 GPa, and 9.6 ± 0.5 GPa, respectively. It was also found that the single-phase AlN coating has a better adhesion strength and scratch strength (LC3 ? 12 N) than the composite AlN/Fe2-3N coating (LC3 ? 10 N). Examination of scratch mechanisms in hard AlN and AlN t Fe2-3N coatings deposited on a soft aluminium substrate showed that the failures in these coatings are due to tensile-type Hertzian cracks. However, as the load increases, the substrate undergoes increasing deformation and failures shift to chipping and interfacial spallation.
关键词： Adhesion strength,Active screen plasma nitriding,Pure aluminium,Conventional plasma nitriding,Scratch resistance,Nanoindentation
更新于2025-09-23 15:23:52
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Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface
摘要： Reliability of interface between two dissimilar materials becomes an important issue due to increasing demands of high-density integrated circuits. Most of failures of semiconductor package occur at the interface between two dissimilar materials in high temperature reflow process, thus, adhesion strength under high temperature should be investigated. In this study, an adhesion shear test jig was newly devised to measure the adhesion strength of epoxy molding compound/Si chip (EMC/chip) interface at high temperature (200 °C). In order to investigate the effect of plasma treatment on adhesion strength and moisture absorption characteristics, the number of plasma treatments was varied. Also, moisture absorption time was varied to observe the moisture uptake and degradation of adhesion strength with respect to plasma treatment number. Atomic force microscope (AFM) was analyzed to verify the surface roughness of silicon chip, and scanning electron microscopy (SEM) was used to observe cross-sectional fractured morphology after adhesion strength test. From this study, it was found that the plasma treatments affect much the adhesion strength and moisture uptake at the interface between the EMC/Chip interface.
关键词： Semiconductor package,Moisture absorption,Adhesion strength,Plasma treatment
更新于2025-09-23 15:23:52
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Influence of surface treatment with infrared nanosecond laser on adhesion performance of adhesion-bonded carbon fiber/epoxy composite
摘要： The surface treatment of carbon fiber/epoxy composites with a pulsed infrared (1064 nm wavelength) nanosecond (7 ns pulse duration) laser has been investigated. It is found that single 1064 nm laser pulse can remove the polymer matrix from composite surface to expose the carbon fibers by expansion of the pyrolysis gas resulting from laser-induced polymer degradation. The influences of laser power density and scan strategy on matrix removal process have been studied. The bonding strength of laser processed, adhesion-bonded CFRP (carbon fiber reinforced plastic) increase with lower matrix residues on the fibers and a linear relation is found. The adhesion-bonding strength of CFRP surfaces, tested by lap-joint shear test, exceeds the strength measured for untreated and abrasion treated (SiC paper) samples. The main origin of fiber damage of the laser-treated surface is mechanical fracture rather than thermal damage as found by laser scanning confocal microscope and scanning electron microscope. The characteristic morphologies and failure modes of shear-tested surfaces are analyzed. The obvious improvement of adhesive strength is achieved by the laser-treated surfaces attributed to matrix removal and carbon fibers protruding. A 1 D model is established to describe temperature and internal gas pressure of the irradiated surface. The new laser treatment method needs less laser energy and low pulse numbers and prove the way to an efficient, low-cost surface treatment for preparation of high quality adhesion bonded CFRP components.
关键词： matrix removal,adhesion strength,1064 nm laser,Carbon fiber/epoxy composite
更新于2025-09-19 17:13:59
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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Moisture Barrier, Mechanical, and Thermal Properties of PDMS-PIB Blends for Solar Photovoltaic (PV) Module Encapsulant
摘要： In this study, we have investigated and screened the performance of our adhesive material that does not require an edge seal. This paper primarily focuses on the synergistic properties of PDMS and PIB via physical blending. The UV blocking nature of PDMS and the high adhesion and superior barrier property of PIB were considered. Our polymer blend also maintains the transparency in the visible range. This polymer blends were performed with several kinds of material characterizations such as morphology, hardness, thermal profiles, moisture ingress properties, and adhesion strength. This paper serves to provide discussions on preliminary evaluations for transparent PV module encapsulant.
关键词： PV Encapsulant,Adhesion Strength,Moisture Ingress,PDMS-PIB Blend
更新于2025-09-11 14:15:04