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Influence of Non-Toxic Magnetic Cellulose Nanofibers on Chitosan based Edible Nanocoating: A Candidate for Improved Mechanical, Thermal, Optical, and Texture Properties
摘要： The present work demonstrates the formulation of cellulose nanofiber (CNF) or magnetic cellulose nanofiber (mgCNF) dispersed chitosan based edible nanocoating with superior mechanical, thermal, optical and texture properties. The fabrication of mgCNF is successfully achieved through single-step co-precipitation route, where iron particles get adsorbed onto CNF. The thermal stability of mgCNF is improved considerably, where ~17% reduction in weight is observed, whereas CNF degrades completely under identical conditions. TGA analysis shows that there is an improvement in thermal stability for both CNF and mgCNF reinforced CS nanocoatings, where mgCNF provides more heat dimensional stability than CNF dispersed CS nanocoatings. Further, the edible nanocoatings are stable even at the temperature of heat treatment such as food sterilization. The mechanical property of the mgCNF dispersed chitosan (CS) shows remarkable improvement in tensile strength (57.86±14 MPa) and Young’s modulus (2348.52±276 MPa) compared to neat CS (6.27±0.7 MPa and 462.36±64 MPa, respectively). To recognize the developed materials as safe as food, the quantification of iron is made by using ICP-MS technique. It is noteworthy to mention that mgCNF coated CS help in improving the texture of cut pineapples in comparison with uncoated pineapple slices at ambient condition.
关键词： chitosan,magnetic cellulose nanofibers,cellulose nanofiber,edible nanocoating,packaging property
更新于2025-11-21 11:01:37
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Eumelanin for Nature‐Inspired UV‐Absorption Enhancement of Plastics
摘要： In the human body, the black-brown biopigment eumelanin blocks the harmful ultraviolet (UV) radiation. In the plastics industry, additives are often added to polymers to increase their UV-absorption properties. We herein report an assessment of the biopigment eumelanin as a nature-inspired additive for plastics to enhance their UV-absorption. Since eumelanin is produced by natural sources and is non-toxic, it is an interesting candidate in the field of sustainable plastic additives. In this work, eumelanin-including films of commercial ethylene-vinyl acetate copolymer (EVA), a plastic used for packaging applications, were obtained by melt-compounding and compression molding. The biopigment dispersion in the films was improved by means of the Melanin Free Acid treatment (MFA). It was observed that eumelanin amounts as low as 0.8% wt. cause an increase of the UV absorption, up to one order of magnitude in the UVA range. We also evaluated the effect of eumelanin on the thermal and photostability of the films: the biopigment proved to be double-edged, working both as UV-absorption enhancer and photo-prooxidant, as thermogravimetric analysis (TGA) and infrared (IR) spectroscopy revealed.
关键词： Eumelanin,Packaging,Melanin Free Acid,UV-absorbers,Ethylene-vinyl acetate copolymer,UV-aging
更新于2025-10-22 19:40:53
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Single Flip-Chip Packaged Dielectric Resonator Antenna for CMOS Terahertz Antenna Array Gain Enhancement
摘要： A single dielectric resonator antenna (DRA) capable of enhancing the antenna gain of each element of a 2×2 THz antenna array realized in a 0.18-μm CMOS technology is proposed in this work. The DRA implemented in a low-cost integrated-passive-device (IPD) technology is flip-chip packaged onto the CMOS antenna array chip through low-loss gold bumps. By designing the DRA to work at the higher-order mode of TE3,δ,9, only single DRA instead of conventionally needing four DRAs is required to simultaneously improve the antenna gain of each element of the 2×2 antenna array. This not only simplifies the assembly process but it can also reduce the assembly cost. Moreover, the DRA can provide great antenna gain enhancement because of being made of high-resistivity silicon material and higher-order mode operation. The simulated antenna gain of each on-chip patch antenna of the 2×2 CMOS antenna array can be increased from 0.1 to 8.6 dBi at 339 GHz as the DRA is added. To characterize the proposed DRA, four identical power detectors (PDs) are designed and integrated with each element of the 2×2 THz antenna array, respectively. By measuring the voltage responsivity of each PD output, the characteristics of each antenna of the antenna array with the proposed DRA, including the gain enhancement level and radiation pattern, can be acquired. The measurement results follow well with the simulated ones, verifying the proposed DRA operation principle. The four PDs with the proposed DRA are also successfully employed to demonstrate a THz imaging system at 340 GHz. To the best of the authors’ knowledge, the proposed DRA is the one with the highest-order operation mode at THz frequencies reported thus far.
关键词： Silicon,Flip-chip packaging,Terahertz,CMOS,Terahertz imaging system,Antenna,Higher-order mode,Power detector,Dielectric resonator antenna
更新于2025-09-23 15:23:52
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Inverse design and demonstration of broadband grating couplers
摘要： We present a gradient-based optimization strategy to design broadband grating couplers. Using this method, we are able to reach, and often surpass, a user-specified target bandwidth during optimization. The designs produced for 220 nm silicon-on-insulator are capable of achieving 3 dB bandwidths exceeding 100 nm while maintaining central coupling efficiencies ranging from -3.0 dB to -5.4 dB, depending on partial-etch fraction. We fabricate a subset of these structures and experimentally demonstrate gratings with 3 dB bandwidths exceeding 120 nm. This inverse design approach provides a flexible design paradigm, allowing for the creation of broadband grating couplers without requiring constraints on grating geometry.
关键词： inverse design,optimization,broadband,fiber-packaging,grating couplers
更新于2025-09-23 15:23:52
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Structured-Light Based 3D Reconstruction System for Cultural Relic Packaging
摘要： The non-contact three-dimensional measurement and reconstruction techniques have played a significant role in the packaging and transportation of precious cultural relics. This paper develops a structured light based three-dimensional measurement system, with a low-cost for cultural relics packaging. The structured light based system performs rapid measurements and generates 3D point cloud data, which is then denoised, registered and merged to achieve accurate 3D reconstruction for cultural relics. The multi-frequency heterodyne method and the method in this paper are compared. It is shown that the relative accuracy of the proposed low-cost system can reach a level of 1/1000. The high efficiency of the system is demonstrated through experimental results.
关键词： 3D reconstruction,cultural relics packaging,structured light
更新于2025-09-23 15:23:52
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[IEEE 2018 International Conference on Applied Engineering (ICAE) - Batam, Indonesia (2018.10.3-2018.10.4)] 2018 International Conference on Applied Engineering (ICAE) - Epoxy Adhesive as Die Attach Material in Semiconductor Packaging: A Review
摘要： Semiconductor packaging generally includes many steps such as wafer mounting, wafer dicing, die attach or die bonding, wire bonding, molding, plating, marking, and trim form. Die attach process is one of the crucial process in electronics packaging or semiconductor packaging. So, the die attaches material is an important part of this process. Die attach materials are commonly divided into some categories. The categories cover high and low-temperature application. Some kinds of die attach materials are alternative resins, epoxy adhesive, soft soldering, die attach solders and silver-glass material. In this study focuses to review epoxy adhesive material in die attach process.
关键词： epoxy adhesive material,die attach,semiconductor packaging,material characterization
更新于2025-09-23 15:22:29
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Preparation and Characterization of Polymer Composite Materials Based on PLA/TiO2 for Antibacterial Packaging
摘要： Polymer composite materials based on polylactic acid (PLA) filled with titanium dioxide (TiO2) nanoparticles were prepared. The aim of this work was to investigate the antibacterial action of TiO2 against a strain of E. coli (DH5α) to obtain information on their potential uses in food and agro-alimentary industry. PLA/TiO2 systems were prepared by a two-step process: Solvent casting followed by a hot-pressing step. Characterization was done as a function of particle size (21 nm and <100 nm) and particle content (0%, 1%, 5%, 10%, and 20%, wt %). Structural characterization carried out by X-ray diffraction (XRD) and Fourier Transformed Infrared spectroscopy (FTIR) did not reveal significant changes in polymer structure due to the presence of TiO2 nanoparticles. Thermal characterization indicated that thermal transitions, measured by differential scanning calorimetry (DSC), did not vary, irrespective of size or content, whereas thermogravimetric analysis (TGA) revealed a slight increase in the temperature of degradation with particle content. Bacterial growth and biofilm formation on the surface of the composites against DH5α Escherichia coli was studied. Results suggested that the presence of TiO2 nanoparticles decreases the amount of extracellular polymeric substance (EPS) and limits bacterial growth. The inhibition distances estimated with the Kirby-Bauer were doubled when 1% TiO2 nanoparticles were introduced in PLA, though no significant differences were obtained for higher contents in TiO2 NPs.
关键词： antibacterial packaging,polylactic acid (PLA),polymer nanocomposites,TiO2 nanoparticles
更新于2025-09-23 15:22:29
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Light-Responsive Nanocapsule-Coated Polymer Films for Antimicrobial Active Packaging
摘要： The development of antimicrobial active packaging constitutes a powerful tool to reduce waste and increase quality standards of perishable goods. Among numerous available antimicrobial agents, essential oils stand out for their renowned efficiency, and their use is beneficial due to their sustainability compared to other oil-based antimicrobials. In this work, we report on the use of photo-responsive nanocapsules containing thyme essential oil as functional coatings for polyethylene and polylactic acid films to obtain antimicrobial active packaging. Polymer surface activation treatment enhanced compatibility with nanocapsules solution. The films were analyzed to assess the structural and functional properties of the coating, evaluate morphological changes due to their photo-responsive behavior, and monitor the light-induced release of volatile thyme oil. It was found that 24 h after a 15-min UV exposure of the coated films, the concentration of thyme oil in the headspace was eight times higher with respect to un-irradiated films, thus confirming the efficiency of the light-triggered release system. Therefore, the manufactured films are proposed as on-demand release devices for application in non-contact antimicrobial active packaging.
关键词： antimicrobials,active packaging,coatings,essential oils,photo-responsive nanocapsules
更新于2025-09-23 15:22:29
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[IEEE 2018 IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia) - Chengdu, China (2018.10.26-2018.10.30)] 2018 IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia) - Flexible RFID Patch for Food Spoilage Monitoring
摘要： When food is stored under inappropriate or inadequate temperature, foodstuff would turn rotten as a result of the rapid breed of food spoilage bacteria under warm and wet circumstances where bacteria can be easily generated, the consequences can be worse if human beings eat those degenerative comestible, we might get bromatoxism. This paper focuses on the designing and simulation of a wearable radio frequency identification (RFID) patch for food spoilage monitoring with smart packaging that can be recognized and read temperature information by device supporting near field communication (NFC) technology through an attached circular antenna. More precisely, this patch can be read under a designed high frequency of 13.56MHz, and data is transmitted from the chip MLX90129 with its internal sensor that sends the temperature to the reader module.
关键词： Food Monitoring,RFID,Smart Packaging,Temperature Sensing
更新于2025-09-23 15:22:29
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Reference Module in Materials Science and Materials Engineering || Wafer Bonding
摘要： Wafer bonding has been an important and critical technology in the development of micromachined sensors, actuators, microsystems, and their packaging for many decades. It is also being used in the fabrication of integrated circuits (ICs) and the formation of composite materials and wafers needed in advanced circuit technologies. Wafer, or die, bonding refers to the process whereby two or more wafers of similar or dissimilar materials are, often permanently, attached or bonded together. The individual wafers might have already been through previous fabrication steps to form various features on them, or might just be plain wafers.
关键词： Wafer Bonding,Microsystems,ICs,Packaging,MEMS
更新于2025-09-23 15:21:21