研究目的
To develop a micro-temperature sensor-integrated surface-mounted device (SMD) for accurate and real-time measurement of the junction temperature of an LED.
研究成果
The study demonstrated a Pt microsensor-embedded SMD-LED package for measuring the junction temperature with high precision and simplicity. A highly linear correlation between the junction and sensor temperatures was revealed, which is useful for precise prediction of the junction temperature. The approach allows real-time measurement of the junction temperature and can be extended to the thermal management of LED arrays by integrating them onto a batch-fabricated microsensor array.
研究不足
The study focuses on the thermal management of SMD-LEDs using integrated microsensors and does not address other types of LED packages or applications. The experimental setup may not be suitable for LEDs operating in harsh environments without further modifications.
1：Experimental Design and Method Selection:
The study involved designing and fabricating a Pt-based microscale resistance-temperature detector and mounting an LED on it for simple, precise, and real-time measurement of the junction temperature of the SMD-LED. The Pt microsensor-integrated substrate was batch-fabricated, and the LED die was soldered on it, similar to the typical SMD assembly.
2：Sample Selection and Data Sources:
The study used an InGaN LED (1 W) with Y3Al5O12 phosphor mounted on the microfabricated Pt sensor.
3：List of Experimental Equipment and Materials:
The materials included a SiO2/Si substrate, Ti/Pt layers, thermal grease (Dow Corning TC-4515), SAC-305 solders, and Cu electrodes. The equipment included T3Ster equipment for junction temperature measurement and ANSYS 19.2 for steady-state thermal analysis.
4：2 for steady-state thermal analysis.
Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: The Pt microsensors were fabricated using a lift-off process on the SiO2/Si substrate. The LED was mounted on the sensor using thermal grease with solders and electrodes. The junction temperature was measured using T3Ster equipment, and the temperature-resistance characteristic of the Pt sensor was calibrated.
5：Data Analysis Methods:
The study analyzed the thermal resistance of the SMD-LED package using the T3Ster Master software and performed a numerical simulation to validate the temperature distribution from the LED junction to the Pt microsensor.
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