研究目的
To design and develop a cost-effective nickel hard stamp suitable for fabrication of a new front-side metallization pattern to reduce the shadow losses in solar cells.
研究成果
FEA-based simulation studies determined the optimized design of front-side solar cell metallization pattern. A cost-effective fabrication method was demonstrated for the fabrication of nickel hard stamp using nickel electroless deposition. The nickel hard stamp was capable of withstanding up to 18 imprinting cycles after FOTS-based anti-adhesive coating, exhibiting improved hardness and Young’s modulus.
研究不足
The study focuses on the fabrication and durability of nickel hard stamps for solar cell applications, with potential limitations in scalability and cost-effectiveness for industrial-scale production.
1:Experimental Design and Method Selection:
Finite element analysis (FEA)–based simulations were used to design and optimize front-side metallization grid patterns. Nanoimprint lithography (NIL) followed by an electroless deposition method was used for patterning.
2:Sample Selection and Data Sources:
4-in. single-side polished p-type c-Si wafer (100) orientation with resistivity of 1–5 Ωcm and thickness of (cid:1)220 μm was used for template fabrication.
3:List of Experimental Equipment and Materials:
Laser writer (LW405, CEN, IIT Bombay), UV lithography, e-beam evaporation technique (HHV, 4-target e-beam evaporator), AZ-P4620 positive photoresist, nickel chloride, sodium hypophosphite, triammonium citrate, and ammonium chloride for nickel electroless deposition.
4:Experimental Procedures and Operational Workflow:
The process included UV lithography, nickel electroless plating, and silane-based anti-adhesive coating.
5:Data Analysis Methods:
Surface profilometer, optical microscope, and multimode scanning probe microscope were used for characterization.
独家科研数据包,助您复现前沿成果,加速创新突破
获取完整内容