研究目的
Investigating the characteristics of micron-sized ridge and rod patterns of SiOC created by imprint lithography, focusing on feature fidelity, shape change, and shrinkage as a function of pyrolysis condition and feature size.
研究成果
Sub-micron feature arrays from polymer-derived SiOC are successfully created with good fidelity up to 1200°C for 250 nm features and up to 1400°C for larger features. Feature smoothening and flattening increase with pyrolysis temperature and decrease in feature size, driven by surface diffusion and evaporation-condensation. Linear shrinkage is larger for smaller features and exceeds bulk shrinkage, influenced by surface area to volume ratio. The mathematical model effectively predicts feature evolution, providing insights for high-temperature applications.
研究不足
The study is limited to specific pyrolysis conditions (temperatures up to 1400°C) and feature sizes (down to 250 nm). Feature fidelity loss occurs at higher temperatures and smaller sizes due to surface diffusion and evaporation-condensation, which may affect scalability for very small features. The numerical model relies on approximations and material property estimates.
1：Experimental Design and Method Selection:
The study uses imprint lithography to create sub-micron features from polymer-derived SiOC, with pyrolysis at various temperatures to examine feature fidelity, shape change, and shrinkage. A numerical model based on thermodynamic equations (Kelvin and Gibbs-Thomson) is employed to predict feature evolution.
2：Sample Selection and Data Sources:
Samples are prepared using PHMS (polyhydromethylsiloxane) as the precursor, DVB (divinylbenzene) as the cross-linking agent, and a Pt catalyst. Patterns include arrays of rods and ridges with sizes of 250 nm, 500 nm, 750 nm, and 1 μm.
3：List of Experimental Equipment and Materials:
Equipment includes a tube furnace for pyrolysis, SEM for evaluation, FIB for cutting, and software like ImageJ and Amira for analysis. Materials include PHMS, DVB, Pt catalyst, PDMS for stamping, and Si wafers.
4：Experimental Procedures and Operational Workflow:
The process involves polymer precursor preparation, stamp fabrication using FIB and PDMS, PHMS stamping on substrates, pyrolysis in argon atmosphere at temperatures from 800°C to 1400°C, and feature fidelity evaluation using SEM and software tools.
5：Data Analysis Methods:
Data analysis includes measuring line edge roughness (LER) and inverse circularity (IC) using ImageJ plugins, and numerical simulation of feature shape evolution based on surface diffusion and evaporation-condensation models.
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