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A Ku-band coaxial transit-time oscillator with Pierce-like cathode under permanent magnet packaging
摘要： A novel Ku-band coaxial transit-time oscillator (TTO) with Pierce-like cathode is proposed in this paper. TTO has the characteristics of low space-charge effect and short interaction distance. Combining with these features, we design a novel Pierce-like cathode to lower the demand for the guiding magnetic field. The guiding magnetic field intensity is reduced to about 0.32T by loading the Pierce-like cathode, but the magnetic field intensity is not a stable value, it fluctuates at 0.32T because of the properties of permanent magnet. To achieve the light and small goals of TTO, we design a novel permanent magnet structure with NdFeB. Based on the research, the typical simulation result is that when the diode voltage is 440kV, the beam current is 11kA, the guiding magnetic field is about 0.32T, the device can output 1.46GW microwave pulse at 14.2GHz. The power conversion efficiency is about 30%.
关键词： coaxial transit-time oscillator,Pierce-like cathode,permanent magnet packaging,Ku-band,high power microwave
更新于2025-09-10 09:29:36
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A Low-Noise Image Sensor Readout Circuit With Internal Timing Generator
摘要： We describe the design, development, and performance of a complementary metal-oxide semiconductor (CMOS) image sensor read-out circuit. Designed in a 0.35-μm CMOS technology and occupying an area of 2.3 × 13.6 mm2, the proposed multipixel image sensor readout integrated circuit with internal timing generator achieves high performance with 188.7-μV root mean square (RMS) of ultralow output noise, wide linear dynamic range of 2.3 V, low power consumption of 42 mA, and a simple timing scheme. The approaches to boost linear dynamic range are presented. The image sensor also provides the trigger signal for data acquisition purpose.
关键词： Sensor systems (SYST),sensor packaging (PACK),electromagnetic wave sensors (OPTO)
更新于2025-09-09 09:28:46
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Recent Developments Accelerating SiC Adoption
摘要： The benefits of SiC devices for use in power electronics has been long understood, and over 25 years of sustained development in materials and devices has brought adoption to a tipping point [1,15]. It takes the confluence of many separate developments to build the necessary momentum for accelerated adoption, and we will examine these factors.
关键词： SiC MOSFET,SiC reliability,SiC Schottky Diode,SiC gate oxide,SiC Cascode,Supercascode,Silicon Carbide,SiC,SiC packaging,SiC applications,SiC epitaxy,SiC substrates
更新于2025-09-09 09:28:46
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[IEEE 48th European Solid-State Device Research Conference (ESSDERC 2018) - Dresden (2018.9.3-2018.9.6)] 2018 48th European Solid-State Device Research Conference (ESSDERC) - Low Profile Open MEMS and ASIC Packages manufactured by Flexible Hybrid Integration in a Roll-to-Roll compatible process
摘要： Here we report on a flexible, foil based packaging process in which a standard commercially available MEMS capacitive air pressure sensor is packaged in an “open package” configuration such that the sensitive membrane side of the MEMS is always in contact with the ambient atmosphere. Additionally, the matching ASIC chip to readout the MEMS sensor is integrated into the same package in a System-in-Foil (SiF) configuration. Here, both the MEMS and the ASIC wafers were thinned down to 250 μm, which resulted in a combined package height profile of < 0.5 mm. This foil based patch sensor has then been characterized in ambient air and its performance has been compared against a commercial MEMS (bare die) sensor available as standard Surface Mounted Device (SMD) component having a package height of 1 mm. The electrical performance and the functionality under thermal cycling and thermal shocks of these packaged sensors were found to be identical to the commercially available SMD variant. Furthermore, to demonstrate the applicability of such a thin, flexible foil sensor patch in the field of ?non-invasive“ air pressure measurements on planar and curved surfaces, these sensors were mounted onto the carrosserie of a car at different locations and the air pressure change due to the laminar / non-laminar flow of air (or air turbulence) over these control surfaces were measured. The results further verify the need for such low profile packaging such that the airflow over control surfaces can be measured without disturbing the laminar airflow. This opens up the application field of these packaged sensors for wind turbines, aircraft wings, skyscrapers/buildings and automotive applications.
关键词： System-in-Foil (SiF),Flexible Packaging,Chip-in-Foil (CiF),Flexible Hybrid Electronics (FHE),Roll-to-Roll (R2R)
更新于2025-09-09 09:28:46
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Recent advances in the chemical strengthening of glass
摘要： Since its development in the early 1960s till recently, applications of the glass chemical strengthening technology were limited mostly to aircraft cockpit windshields, photocopier transparencies, and hard disks. The interest has been renewed by a need to have stronger and lighter glass products, led mostly by display cover in personal mobile electronic devices, such as cell phones, and glass packaging for safe delivery of medicines in pharmaceutical applications. In this paper, I suggest that the science of the compressive stress development is nearly completely understood. The so-called “dilation anomaly” is resolved. Newer technologies are being developed, for example, thin float-produced flat glasses can be strengthened with reduced warp. Molten salt bath maintenance techniques to avoid discarding of degraded salt have been developed to some extent. In addition to more and more pharmaceutical businesses looking to strengthen the glass packaging to avoid costly recalls, interest is also high in break-resistant automobile and locomotive transparencies. Other miscellaneous topics where the use of chemically strengthened glass could bring value-added premium are also mentioned.
关键词： molten salt bath,pharmaceutical packaging,chemical strengthening,compressive stress,glass,automobile transparencies,dilation anomaly
更新于2025-09-09 09:28:46
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[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Development of a Flexible Label Integrating a Silicon Bare Die
摘要： This paper presents new developments on the integration of a silicon bare die on or in a flexible layer. In the first part, the process of hybridization of a silicon test vehicle on polyethylene-naphthalate sheet will be presented and electric results will be commented. The second part presents preliminary results of an advanced wafer level process which allows to integrate dies collectively thinned down to 30 μm in a flexible label. The common point of both process is that the components are interconnected by flip-chip.
关键词： Thin silicon Die,Flexible electronics,Packaging
更新于2025-09-09 09:28:46
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[IEEE 2018 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2018.10.23-2018.10.25)] 2018 International Wafer Level Packaging Conference (IWLPC) - Advanced EWLB (Embedded Wafer Level Ball Grid Array) Solutions for Mmwave Applications
摘要： FOWLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to its unique advantages. The technology combines high performance, increased functionality with a high potential for heterogeneous integration and reduces the total form factor all in a cost-effectiveness format. FOWLP volumes have largely been driven by mobile and consumer applications (RF, BB, connectivity, NFC, PMIC, audio codec, MCU etc) and are now moving to 5G communication, mmWave, automotive, MEMS/Sensor and IoT/WE applications. Advanced embedded Wafer Level Ball Grid Array (eWLB) provides a versatile platform for the semiconductor industry’s technology evolution from single or multi-die 2D package designs to 2.5D interposers and 3D System-in-Package (SiP) configurations. WLP (wafer level packaging) has already been adopted in the automotive market for cabin or infotainment applications as well as 77GHz radar sensors utilizing FO-WLP. This study focuses on the development of eWLB for mmWave applications above 60GHz with CMOS IC technology. Additionally the case study of 77GHz ADAS automotive radar is discussed. Package design optimization of single-die and multi-die, electrical performance characterization and component level reliability tests are presented.
关键词： Reliability,FOWLP,mmWave,Automotive packaging,77GHz ADAS packaging,eWLB
更新于2025-09-04 15:30:14
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[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Lidded vs. Lidless: A Thermal Study
摘要： In the recent years, lidless (bare) die packaging starts to appear in the high power applications with a large die size, complementing the conventional lidded packaging. Given the vast parameters’ space of the lidded vs. lidless designs, a systematic study is necessary to develop a clear and practical design recommendations. In this work, an analytical study is conducted to assess the sensitivity of the thermal spreading resistance (TSR) and the total junction-to-ambient thermal resistance (Rja) on various parameters for a typical lidded (LD) and lidless (LL) package configuration. Useful findings and design guidance are provided.
关键词： junction-to-ambient thermal resistance,lidded packaging,thermal spreading resistance,lidless packaging,thermal management
更新于2025-09-04 15:30:14
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[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Copper-based Graphene Nanoplatelet Composites as Interconnect for Power Electronics Pacakging
摘要： The present investigation demonstrates a single-step electrodeposition route for the fabrication of compact copper-based graphene nanoplatelets (GnPs) nanocomposite coatings, with dispersed GnP co-deposition. The effect of cathodic current density on the surface morphology of the deposits was examined. With increasing deposition current densities from 10 to 40 mA/cm2, there seemed to be a gradual increase in the lateral size of co-deposited GnPs and a decrease in their distribution density, along with a progressive decrease in the deposit surface feature. The chemical state of GnP from the sub-surface region of composite coatings was assessed using XPS in conjunction with Ar ion sputtering and found comparable to that of pristine GnPs. The Cu-GnP composite coatings exhibited slightly higher electrical sheet resistance, compared to that of the untreated Cu and pure Cu deposited counterparts.
关键词： power electronic systems packaging,heterogeneous integration,Cu electroplating,composite electrodeposition
更新于2025-09-04 15:30:14
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Modeling Spin Coating over Topography and Uniformity Improvements through Fill Patterns for Advanced Packaging Technologies
摘要： An empirical model is proposed for predicting surface variations following dielectric spin coating (DSC) as applied to existing underlying topography in redistribution layer (RDL) fabrication. Test structures that represent a wide range of underlying feature widths, spacings, and heights are designed and fabricated. These are coated with multiple thicknesses of polyimide, and their surfaces are profiled and analyzed. An empirical model based on spatial filtering over underlying features is developed, with model parameters fit to coatings over a single feature for each set of process parameters. The model predicts post-coating thicknesses at the chip-scale. Comparisons between predictions and experimental results show an RMS error of 4.4% of the feature heights when averaged over each region profiled. Finally, fill patterns are designed and new test structures are simulated using these patterns. Simulation results suggest that global variations can be substantially reduced using such fill patterns, and these results are confirmed experimentally.
关键词： Process Modeling,2.5D Integration,Polyimide,Spin Coating,Fill Patterns,Dielectric Spin Coating,Re-Distribution Layers,RDLs,Packaging
更新于2025-09-04 15:30:14