研究目的
To develop and validate procedures for coring small areas from photovoltaic modules without causing damage, enabling microscopic analysis to relate microscopic properties with efficiency-related parameters.
研究成果
Developed coring procedures successfully allow for the removal of small areas from PV modules without introducing damage, enabling detailed microscopic analysis. The procedures are adaptable to different types of modules and stress conditions, proving versatile for reliability studies.
研究不足
The full coring procedure requires breaking the tempered glass, uses carcinogenic TCE, and results in small-size samples with random shapes for Si. Partial coring requires adaptation for different module types and stress conditions.
1：Experimental Design and Method Selection:
Developed two coring procedures ('full coring' and 'partial coring') for different types of PV modules (Si, CIGS, CdTe).
2：Sample Selection and Data Sources:
Used commercial and lab-stressed PV modules.
3：List of Experimental Equipment and Materials:
Diamond glass drilling machine (AMZ1 from CRL, Inc.), hollow diamond drill bits, Dremel tool, trichloroethylene (TCE), Red Lube, cyanoacrylate-based adhesive, thermal wax.
4：Experimental Procedures and Operational Workflow:
Detailed steps for coring, including removal of layers, coring under controlled conditions, and sample preparation for analysis.
5：Data Analysis Methods:
SEM, EDS, EBSD, SKPFM, DLIT, ILIT, PL, EL, EBIC analyses to verify no damage was caused by coring.
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