研究目的
To investigate the effect of Y doping on the performance and stability of nontoxic water-induced InYO thin film transistors (TFTs) prepared by an environmentally friendly aqueous solution process.
研究成果
Y doping in InYO thin films reduces oxygen vacancies and interface trap density, leading to improved electrical performance and stability in TFTs. The optimal doping level is 2 mol%, achieving a mobility of 12.8 cm2/V s, threshold voltage of 1.4 V, subthreshold swing of 0.33 V/decade, and a threshold voltage shift of 2.31 V under positive bias stress. This makes water-induced InYO TFTs suitable for low-cost, environmentally friendly electronic devices.
研究不足
The study is limited to specific Y doping concentrations (up to 6 mol%) and annealing conditions (350°C). Potential optimizations could include exploring higher doping levels, different annealing temperatures, or other dopants to further enhance performance and stability.
1:Experimental Design and Method Selection:
The study uses solution combustion synthesis with aqueous precursors to fabricate InYO thin films. The rationale is to create environmentally friendly, low-cost TFTs with reduced oxygen vacancies and improved stability. Theoretical models include equations for threshold voltage, mobility, subthreshold swing, and interface trap density calculations.
2:Sample Selection and Data Sources:
Precursor solutions are prepared with indium nitrate hydrate and yttrium nitrate hydrate dissolved in deionized water, with Y/In molar ratios of 0, 1, 2, 4, and 6 mol%. Data is collected from fabricated TFT devices.
3:List of Experimental Equipment and Materials:
Equipment includes a spin coater, hot plate, furnace, Agilent 4155C semiconductor characterization system, UV/visible spectrometer, XPS (Thermo-ESCALAB 250Xi), GIXRD, AFM, and LCR meter (Agilent E4980A). Materials include In(NO3)3·xH2O, Y(NO3)3·xH2O, deionized water, ALD Al2O3 gate dielectric, and source/drain electrodes patterned with a stainless steel mask.
4:Experimental Procedures and Operational Workflow:
Precursor solutions are stirred for 2 hours, spin-coated on ALD Al2O3 films at 6000 rpm for 30 seconds, dried at 120°C for 10 minutes, and annealed at 350°C for 2 hours. Source and drain electrodes are deposited, and electrical and material characterizations are performed.
5:Data Analysis Methods:
Data is analyzed using equations for mobility, threshold voltage, subthreshold swing, and interface trap density. Statistical analysis includes fitting to stretched exponential decay for bias stress stability.
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semiconductor characterization system
4155C
Agilent
Measuring electrical characteristics of thin-film transistors
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X-ray photoelectron spectroscopy
ESCALAB 250Xi
Thermo
Analyzing chemical bonding states of films
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LCR meter
E4980A
Agilent
Measuring capacitance-voltage characteristics
E4980A/E4980AL Precision LCR Meter
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UV/visible spectrometer
Examining optical transmittance of thin films
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glancing incidence X-ray diffractometer
Structural analysis of thin films using Cu Kα radiation
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atomic force microscope
Investigating surface morphology of thin films
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spin coater
Coating precursor solutions on substrates
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hot plate
Drying liquid films
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furnace
Annealing devices
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atomic layer deposition system
Growing Al2O3 gate dielectric films
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